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Stacked semiconductor chip RGBZ sensor

A semiconductor and chip technology used in the field of electronics

Active Publication Date: 2017-03-01
GOOGLE LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since many computing systems with imaging capabilities (e.g. laptops, tablets, smartphones, etc.) are mobile in nature, the integration of time-of-flight operation with traditional image acquisition presents many design challenges such as cost and packaging challenges

Method used

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  • Stacked semiconductor chip RGBZ sensor
  • Stacked semiconductor chip RGBZ sensor
  • Stacked semiconductor chip RGBZ sensor

Examples

Experimental program
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Embodiment Construction

[0015] "RGBZ" image sensors are an attractive solution for both traditional image acquisition and time-of-flight depth analysis within the same camera package. An RGBZ image sensor is an image sensor that includes different kinds of pixels, some of which (RGB pixels) are sensitive to visible light, while others (time-of-flight pixels or "Z" pixels) are used to measure depth information.

[0016] In a typical implementation, the time-of-flight pixels are designed to be sensitive to IR light because, as mentioned above, IR light is used for the time-of-flight measurements, so that the time-of-flight measurements do not interfere with the imaging function of conventional RGB pixels. Time-of-flight pixels also have special associated clocks and / or timing circuits to measure when light is received at the pixel. However, because time-of-flight pixels are sensitive to IR light, they may also be conceived to function (eg in the second mode) as IR pixels instead of time-of-flight pixel...

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Abstract

An apparatus is described that includes a first semiconductor chip having a first pixel array. The first pixel array has visible light sensitive pixels. The apparatus includes a second semiconductor chip having a second pixel array. The first semiconductor chip is stacked on the second semiconductor chip such that the second pixel array resides beneath the first pixel array. The second pixel array has IR light sensitive pixels for time-of-flight based depth detection.

Description

technical field [0001] The field of the invention relates generally to the field of electronics, and more particularly to stacked semiconductor chip RGBZ sensors. Background technique [0002] Many existing computing systems include one or more conventional image acquisition cameras as integrated peripherals. The current trend is to enhance the imaging capabilities of computing systems by integrating depth acquisition into their imaging components. Depth acquisition can be used, for example, to perform various smart object recognition functions, such as facial recognition (e.g. for security system unlocking) or hand gesture recognition (e.g. for contactless user interface functions). [0003] A method of depth information acquisition known as "time-of-flight" imaging sends light from the system onto an object and, for each of the image sensor's multiple pixels, measures the time between the emission of the light and the receipt of the reflected image . The image produced ...

Claims

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Application Information

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IPC IPC(8): H01L27/146
CPCH01L27/14627H01L27/14629H01L27/14634H01L27/14645H01L27/14649H01L27/14652H01L27/14621H01L27/14636H04N25/705H04N25/134H01L2924/0002G06T7/50H04N23/11H01L2924/00H01L25/043H04N25/75H04N25/772G01S17/08
Inventor 温宗晋
Owner GOOGLE LLC