Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Method and device for preparing flexible electronic circuit through liquid metal

A liquid metal and electronic circuit technology, applied in printed circuit, metal material coating technology, electrical components, etc., can solve the problems of difficult liquid metal spreading, high requirements for experimental equipment, low production efficiency, etc., to achieve small size The chemical, preparation method is simple and easy to use, and the effect of flexible use

Active Publication Date: 2017-03-15
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
View PDF6 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The existing manufacturing methods of flexible electronic circuits based on liquid metal mainly include molding, printing, ultrasonic deposition, etc., but these methods have problems such as complex process, high requirements for experimental equipment, and low production efficiency.
In addition, due to the large surface tension of the liquid metal itself, it is difficult to spread the liquid metal in the process of combining the liquid metal material with the flexible substrate material.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for preparing flexible electronic circuit through liquid metal
  • Method and device for preparing flexible electronic circuit through liquid metal
  • Method and device for preparing flexible electronic circuit through liquid metal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] In this embodiment, the preparation device of the flexible electronic circuit is as figure 1 As shown, it includes a vacuum chamber 1 , a target pool 3 located in the vacuum chamber, a substrate 9 and a substrate holder 2 . The flexible substrate is fixed on the surface of the substrate 9 , and the substrate 9 is fixed by the substrate frame 2 and located above the target pool 3 .

[0036] The vent pipe 6 communicates with the vacuum cavity 1 . The vacuum unit 4 communicates with the vacuum cavity 1 .

[0037] The manufacturing device of the flexible electronic circuit also includes an electrostatic application unit 8 for applying electrostatic charges on the surface of the flexible substrate. The displacement control unit 7 is connected to the electrostatic application unit 8 and can control the displacement of the electrostatic application unit 8 .

[0038] In this embodiment, the electrostatic application unit 8 includes an electrostatic scanning probe and a power...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method and device for preparing a flexible electronic circuit through liquid metal. A heat evaporation technology or a sputtering technology is adopted, the liquid metal is used as an evaporation source or a sputtering source, liquid metal particles are obtained through heat evaporation or bombardment sputtering to be deposited on the surface of a flexible substrate, and a liquid metal film is formed. The method is simple and practicable, and small size forming of the flexible electronic circuit is facilitated. In addition, the preparing device is simple in structure, two manners of heat evaporation and sputtering can be carried out on a liquid metal target, and therefore use is flexible.

Description

technical field [0001] The invention relates to the technical field of liquid metals, in particular to a method and device for preparing flexible electronic circuits using liquid metals. Background technique [0002] In life, electronic devices can be seen everywhere, such as mobile phones, computers, watches, massage chairs, pedicure instruments, etc. Most of these electronic devices are rigid and not suitable for objects with non-planar surfaces, which leads to the application of electronic devices in some aspects. severely restricted. With the continuous development of electronic science and technology and the improvement of living standards, people have put forward new requirements for electronic devices in daily life. For this reason, the concept of flexible electronics has been proposed. [0003] Flexible electronics is an emerging electronic technology. Its devices have unique flexibility / extensibility. At present, electronic devices made of organic / inorganic materia...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23C14/26C23C14/35C23C14/02H05K3/14
CPCC23C14/02C23C14/26C23C14/35H05K3/14
Inventor 李润伟郑春蕾刘宜伟
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com