Method and device for preparing flexible electronic circuit through liquid metal

Abstract

The invention provides a method and device for preparing a flexible electronic circuit through liquid metal. A heat evaporation technology or a sputtering technology is adopted, the liquid metal is used as an evaporation source or a sputtering source, liquid metal particles are obtained through heat evaporation or bombardment sputtering to be deposited on the surface of a flexible substrate, and a liquid metal film is formed. The method is simple and practicable, and small size forming of the flexible electronic circuit is facilitated. In addition, the preparing device is simple in structure, two manners of heat evaporation and sputtering can be carried out on a liquid metal target, and therefore use is flexible.

Description

technical field

[0001] The invention relates to the technical field of liquid metals, in particular to a method and device for preparing flexible electronic circuits using liquid metals. Background technique

[0002] In life, electronic devices can be seen everywhere, such as mobile phones, computers, watches, massage chairs, pedicure instruments, etc. Most of these electronic devices are rigid and not suitable for objects with non-planar surfaces, which leads to the application of electronic devices in some aspects. severely restricted. With the continuous development of electronic science and technology and the improvement of living standards, people have put forward new requirements for electronic devices in daily life. For this reason, the concept of flexible electronics has been proposed.

[0003] Flexible electronics is an emerging electronic technology. Its devices have unique flexibility / extensibility. At present, electronic devices made of organic / inorganic materia...

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