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A temperature-measuring layer molding process for a thermal insulation container

A thermal insulation container and molding process technology, applied in the direction of coating, etc., can solve the problems of inconvenience, vibration of the thermal insulation container, and difficulty in obtaining the actual temperature of the inner cavity of the airtight thermal insulation container, and achieve the effect of temperature measurement function protection

Active Publication Date: 2019-10-25
石狮市洋鸿新能源科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Insulation containers play an important role in the logistics cold chain. In the traditional cold chain management, only external profile temperature measuring instruments test the temperature of the insulated container. On the one hand, it is inconvenient; Temperature, if a temperature measuring chip can be embedded in the thermal insulation container, it will help to promote the refined management of the cold chain, but the thermal insulation container generally has a specific thermal insulation structure. If the chip is forcibly embedded, the original thermal insulation structure of the thermal insulation container may be destroyed , and the thermal insulation container is often subject to bumps and vibrations during logistics and transportation. Conventional chip fixing methods are difficult to fix chips reliably. How to solve these problems is a research direction

Method used

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  • A temperature-measuring layer molding process for a thermal insulation container
  • A temperature-measuring layer molding process for a thermal insulation container

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Embodiment Construction

[0028] like figure 1 , 2 As shown, a temperature-measuring layer molding process of a thermal insulation container is used to form a surface layer with a temperature-measuring chip 4 at a thermal insulation container 1. It is characterized in that: the molding process includes the following steps in sequence.

[0029] A1. Prepare the thermal insulation container 1 with foam material.

[0030] A2. Apply multi-layer outer wall sheets 3 on the outer surface of the heat preservation container. When it is necessary to place the temperature measuring chip 4 on the outer surface, place the temperature measuring chip on the adjacent two layers of outer wall sheets 2 in this step. middle.

[0031] A3. Put a hard support block into the inner cavity 5 of the heat preservation container, so that the outer surface of the support block is in contact with the inner cavity wall of the heat preservation container to form a support to prevent the wall of the heat preservation container from s...

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Abstract

The invention discloses a temperature measuring layer forming process of an insulation container for forming a surface layer with a temperature measuring chip on the insulation container. The forming process comprises such steps as preparation of a foaming material container, sheet pasting and sheet curing; sheets are carbon fiber cloth or glass fiber cloth; and the temperature measuring chip is positioned between two layers of sheets in the sheet pasting procedure. The forming process can implant the temperature measuring chip in the insulation container in a reliable fixing mode without damaging a traditional insulation structure of the insulation container.

Description

technical field [0001] The invention relates to the field of heat preservation equipment, in particular to a forming process of a temperature measuring layer of a heat preservation container. Background technique [0002] Insulation containers play an important role in the logistics cold chain. In the traditional cold chain management, only external profile temperature measuring instruments test the temperature of the insulated container. On the one hand, it is inconvenient. Temperature, if a temperature measuring chip can be embedded in the thermal insulation container, it will help to promote the refined management of the cold chain, but the thermal insulation container generally has a specific thermal insulation structure. If the chip is forcibly embedded, the original thermal insulation structure of the thermal insulation container may be destroyed , and insulated containers are often subject to bumps and vibrations during logistics and transportation. Conventional chip ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/14B29C45/17
CPCB29C45/1418B29C2045/14245
Inventor 张国清张漫莉张慧娴
Owner 石狮市洋鸿新能源科技有限公司
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