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Touch lead structure and manufacturing method thereof

A touch lead wire and manufacturing method technology, which can be applied to instruments, computing, electrical digital data processing, etc., can solve problems such as poor adhesion between metal and insulating layer 33, increase adhesion between metal lead and insulating layer, and prolong product production cycle. , to achieve the effect of reducing labor and product costs, improving product yield, and shortening product production cycles

Active Publication Date: 2019-08-16
KUSN INFOVISION OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

see figure 1 As shown, the touch lead structure 30 includes a first metal lead 31, a second metal lead 32, and an insulating layer 33 disposed between the first metal lead 31 and the second metal lead 32. Due to the attachment of the metal and the insulating layer 33 The force is poor, and the end of the insulating layer 33 bonded to the first metal lead 31 is easily warped, causing the second metal lead 32 bonded to the top of the insulating layer 33 to warp and break
However, the existing method for improving the warpage of the end of the insulating layer is to increase the adhesion between the metal lead and the insulating layer 33 by improving the process conditions, which will increase the manpower input and product cost, and also prolong the product production cycle. Product yield cannot be guaranteed

Method used

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  • Touch lead structure and manufacturing method thereof
  • Touch lead structure and manufacturing method thereof
  • Touch lead structure and manufacturing method thereof

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Embodiment Construction

[0021] In order to make the purpose, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] figure 2 is a structural schematic diagram of the touch lead structure in the embodiment of the present invention, image 3 is a schematic diagram of the structure of the first metal lead, Figure 4 yes figure 2 Sectional view at middle IV-IV. Specifically, see Figure 2 to Figure 4 The touch lead structure 10 of the present invention includes a plurality of first metal leads 11 , a plurality of second metal leads 12 , and an insulating layer 13 disposed between the first metal leads 11 and the second metal leads 12 .

[0023] The first metal leads 11 are in the shape of metal strips, and a plurality of first metal leads 11 are attached to the glass substrate 20 (ie, the glass substrate of the CF substrate) horizontally, parallel a...

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Abstract

The invention provides a touch lead structure. The touch lead structure comprises the first metal leads, a second metal lead, and an insulating layer glued between the first metal lead and the second metal lead; multiple first metal leads are glued on a glass substrate in parallel at intervals; gaps are symmetrically formed on two sides of the first metal lead; the insulating layer extends to a gap central line L from the upper side of one end of the first metal lead along the first metal lead and is in gluing connection with the glass substrate and the first metal lead at the lower side; one part of the second metal lead is in gluing connection with the insulating layer, the other part of the second metal lead is in gluing connection with the first metal lead without the insulating layer at the upper side; and one end of the second metal lead in gluing connection with the first metal lead is electrically connected with a touch FPC, and the other end is electrically connected with a touch sensing layer. The invention further provides a touch lead structure manufacturing method. The second metal lead of the above mentioned touch lead structure is hard to upwarp and break; and the product yield is improved, the labor cost and the product cost are lowered, and the production period is shortened.

Description

technical field [0001] The invention relates to the technical field of touch display, in particular to a touch lead structure and a manufacturing method thereof. Background technique [0002] With the development of the information age and the acceleration of the pace of life, touch technology has gradually replaced the traditional mouse and keyboard due to its humanized design and simple and fast input, and is widely used in various electronic products. Among them, the touch display panel is widely used due to its advantages of fast response, high sensitivity, good reliability and high durability. The principle of touch screen sensing is that voltage acts on the four corners of the screen sensing area and forms a fixed electric field. When a finger touches, a capacitance change occurs between the human body and the transparent electrode, which can cause the electric field to induce a current, which is measured by the controller. According to the current The contact positio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/047
CPCG06F3/047G06F2203/04103
Inventor 刘鹏谢颖颖张云
Owner KUSN INFOVISION OPTOELECTRONICS