Touch lead structure and manufacturing method thereof
A touch lead wire and manufacturing method technology, which can be applied to instruments, computing, electrical digital data processing, etc., can solve problems such as poor adhesion between metal and insulating layer 33, increase adhesion between metal lead and insulating layer, and prolong product production cycle. , to achieve the effect of reducing labor and product costs, improving product yield, and shortening product production cycles
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[0021] In order to make the purpose, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0022] figure 2 is a structural schematic diagram of the touch lead structure in the embodiment of the present invention, image 3 is a schematic diagram of the structure of the first metal lead, Figure 4 yes figure 2 Sectional view at middle IV-IV. Specifically, see Figure 2 to Figure 4 The touch lead structure 10 of the present invention includes a plurality of first metal leads 11 , a plurality of second metal leads 12 , and an insulating layer 13 disposed between the first metal leads 11 and the second metal leads 12 .
[0023] The first metal leads 11 are in the shape of metal strips, and a plurality of first metal leads 11 are attached to the glass substrate 20 (ie, the glass substrate of the CF substrate) horizontally, parallel a...
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