Basin frame for low-profile speakers

Abstract

The invention belongs to the field of loudspeakers, and more particularly relates to a basin frame, a tooling and an assembly method of a thin type loudspeaker. The basin frame of the thin type loudspeaker comprises a basin frame body, wherein the basin frame body is provided with a circuit board mounting region, positioning grooves for guiding coil braided wires are formed in the basin frame body on two sides of the circuit board mounting region, wire threading holes which allow the coil braided wires to pass through are formed in the basin frame body by the side of the positioning grooves, and each positioning groove is communicated with the corresponding wire threading hole. The basin frame of the thin type high-power loudspeaker is designed by the invention, the structure of the basin frame is improved, the wire threading holes are formed to facilitate the coil braided wires to pass through and form loose portions in the interior of the basin frame, thus the coil braided wires do not vibrate up and down along with a vibrating diaphragm, the power of the product is improved, the power of the loudspeaker can reach 4W or so, the problem of breakage of the wires due to fatigue is avoided to a great extent, further the influence of manual operation on product consistency does not exist due to the absence of a glue dispensing process.

Description

technical field [0001] The invention belongs to the field of loudspeakers, in particular to a basin frame of a thin loudspeaker. Background technique [0002] With the increasingly fierce competition of many consumer electronic products, manufacturers have higher and higher requirements for the specifications of the speakers attached to these electronic products. In addition to hoping that the speaker can be thinner and lighter in size to match the thin design of electronic products In addition, it is also hoped that the speaker can output sound with a wider range. [0003] In the prior art, the lead wire of the voice coil is fixed on the diaphragm by glue, and the other end of the lead wire of the voice coil is welded on the circuit board of the speaker. The disadvantage of this method is that the power withstand is small, generally below 2W. In the dotted line method, when the voice coil vibrates, the lead wire of the voice coil will vibrate with the diaphragm, which may ...

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Problems solved by technology

[0003] In the prior art, the lead wire of the voice coil is fixed on the diaphragm by glue, and the other end of the lead wire of the voice coil is welded on the circuit board of the speaker. The disadvantage of this method is that the power withstand is small, generally below 2W. In the dotted line method, when the voice coil vibrates, the lead wire of the voice coil will vibrate with the diaphragm, which may easily cause fatigue and disconnection of the lead wire. In addition, the lead wire is connected to the diaphragm, which also increases the load on the diaphragm, resulting in a decrease in sound quality. Distortion will also increase, and the dot-line method requires a lot of manual work. There are uncertainties in the shape of the glue and the amount of glue, which will cause an imbalance in the quality of the diaphragm, affect the vibration quality of the diaphragm, and cause the quality of the speaker. The consistency is poor, and there are large differences in the same batch of products

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