Method for eliminating high temperature fault of antiskid brake control device

Abstract

The invention relates to a method for eliminating the high temperature fault of an antiskid brake control device. With the method adopted, the heat dissipation capacity of the antiskid brake control device can be improved under a condition that a shell material is not changed, so that the surface temperature of the shell of the antiskid brake control device can be lower than 100 Celsius degrees under a 70-Celsius degree high-temperature environment and a working condition. Heat dissipation measures are taken under a condition that the 125-Celsius degree rated temperature of existing high-temperature components is not changed, so that the components can work below 100 Celsius degrees. The cost of improvement is lower than the cost of redesign, energy can be saved, and consumption can be reduced. Aluminum is used to manufacture the shell, and heat dissipation grooves are machined in the shell, an installation height between an antiskid brake control device installation surface and an aircraft is increased, and therefore, the heat dissipation capacity of the shell and the antiskid brake control device installation surface can be enhanced, and high temperature faults generated when the antiskid brake control device is used for a long time under the 70-Celsius degree high-temperature environment can be eliminated.

Description

technical field [0001] The invention relates to the field of high-temperature fault analysis of civil transport aircraft electronic products, in particular to a method for eliminating high-temperature faults of an anti-skid brake control device. Background technique [0002] The high temperature of electronic components at home and abroad is generally 125°C, and the ambient temperature reaches 70°C. Due to the heat generated by the operation of electronic products, it is measured that it exceeds 125°C, and high temperature failures will occur at this time. To eliminate failures of electronic products under high temperature conditions, design improvements that increase heat dissipation are required. [0003] The anti-skid brake control device is an accessory of the aircraft anti-skid brake system. It is powered by the aircraft, receives the electrical signal of the wheel speed sensor, and controls the brake pressure during the anti-skid brake process. It can complete the norm...

AI Technical Summary

Problems solved by technology

[0024] 1) The cost of selecting high temperature resistant components is too high;

[0025] 2) Domestic anti-skid brake control devices are currently closed shells, and shells with ventilation holes cannot be used;

[0026] 3) Materials with good thermal conductivity are expensive and unrealistic;

[0027] 4) Installing a cooling fan will increase the weight, and civil aviation has restrictions on the weight of the product

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