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Method for preparing novel piezoelectric composite film sensor

A thin film sensor, piezoelectric composite technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, circuits, etc., can solve the problems of brittleness and heavy weight , to achieve the effect of broad application prospects, improved integration, and good designability

Inactive Publication Date: 2017-03-29
BEIHANG UNIV
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  • Summary
  • Abstract
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AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems that the traditional piezoelectric ceramic sensor is brittle, heavy and cannot be pasted on the curved surface structure, the present invention provides a new preparation method of the piezoelectric composite film sensor to replace the traditional PZT piezoelectric ceramic sensor

Method used

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  • Method for preparing novel piezoelectric composite film sensor
  • Method for preparing novel piezoelectric composite film sensor
  • Method for preparing novel piezoelectric composite film sensor

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Embodiment Construction

[0018] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0019] Such as figure 1 , 5 , Shown in 6, the preparation method of a kind of novel piezoelectric composite film sensor of the present invention, its specific practice is as follows:

[0020] The preparation of the new piezoelectric composite film mainly includes the preparation of the new piezoelectric composite film, the polarization of the new piezoelectric composite film and the packaging of the piezoelectric composite film sensor.

[0021] The preparation process of novel piezoelectric composite film of the present invention is as follows:

[0022] Such as figure 2 As shown, the present invention selects the casting method to prepare the piezoelectric composite film. Compared with other preparation methods, the casting method is not only simple and convenient in process, but also can ensure the flexibility of the piezoelectric composite film,...

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Abstract

The invention relates to a method for preparing a novel piezoelectric composite film sensor. The method comprises preparation of a novel piezoelectric composite film, local polarization of the piezoelectric composite film, and encapsulation of a piezoelectric composite film sensor. Compared with the general composite film, the novel piezoelectric composite film provided by the invention has better piezoelectric property. The prepared novel piezoelectric composite film sensor has light weight, designability and good flexibility, and can be suitable for a curved surface structure; furthermore, compared with the traditional PVDF piezoelectric film, the novel piezoelectric composite film has the advantage that the piezoelectric property is greatly improved; and thus, the novel piezoelectric composite film sensor has wide application prospect in the field of structural health monitoring.

Description

technical field [0001] The invention relates to a preparation method of a novel piezoelectric composite film sensor, belonging to the technical field of structural health monitoring. Background technique [0002] The shape, structural form and geometric dimensions of modern aircraft structures tend to become more and more complex. Lightweight alloys and composite materials are the main materials of aircraft structures. With the prolongation of service time, damage such as cracks will occur. If such damage cannot be detected in time, it will increase the maintenance cost of the aircraft, reduce the service life of the aircraft, and even seriously affect the safety of the aircraft. With the development of intelligent materials and structures, the structural health monitoring (SHM) of a single aircraft has become an important trend to ensure the structural safety of aircraft. It can guarantee the safety and reliability of the aircraft, reduce maintenance costs, and extend the...

Claims

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Application Information

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IPC IPC(8): H01L41/37H01L41/257H01L41/23
CPCH10N30/02H10N30/045H10N30/092
Inventor 何晶靖刘晓鹏方小亮张卫方娄伟涛董邦林
Owner BEIHANG UNIV
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