Thermal bubble type ink-jet printing head and manufacturing method thereof

An inkjet print head and a manufacturing method are used in inkjet printing. It can solve problems such as difficult to process ink chambers

Inactive Publication Date: 2017-04-05
苏州工业园区纳米产业技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the height of the prepared ink cavity is limited by the thickness of the sacrificial layer (only 10 microns), so it is difficult to process a high-depth ink cavity

Method used

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  • Thermal bubble type ink-jet printing head and manufacturing method thereof
  • Thermal bubble type ink-jet printing head and manufacturing method thereof
  • Thermal bubble type ink-jet printing head and manufacturing method thereof

Examples

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Embodiment Construction

[0042] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0043] See figure 1A thermal bubble type inkjet printing head shown in a preferred embodiment of the present invention includes a substrate 1, a cover sheet 13 bonded on the substrate 1 and a heating element 4 arranged on the substrate 1, CMOS driving circuit 2 and metal electrodes 5 . The substrate 1 is made of insulating material, including but not limited to silicon; the cover sheet 13 is made of insulating material, including but not limited to silicon. The substrate 1 and the cover sheet 13 are bonded through a bonding process. The bonding process used in this embodiment is preferably aluminum-germanium bonding or gold-tin bonding. A bonding layer is formed between...

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PUM

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Abstract

The invention relates to a thermal bubble type ink-jet printing head and a manufacturing method thereof, and is applied to ink-jet printing. The thermal bubble type ink-jet printing head comprises a substrate and a cover plate bonded on the substrate, an ink chamber for storing ink is formed between the substrate and the cover plate in a surrounding manner, an ink supply channel communicating with the ink chamber is formed on the substrate in a penetrating manner, nozzles communicating with the ink chamber are formed on the cover plate in a penetrating manner, the substrate is provided with a heating element for heating the ink in the ink chamber, and the thermal bubble type ink-jet printing head also comprises a driving circuit electrically connected with the heating element and a metal electrode electrically connected with the heating element and the driving circuit.

Description

technical field [0001] The invention relates to a thermal bubble type inkjet printing head and a manufacturing method thereof, which are applied to inkjet printing. Background technique [0002] The thermal bubble inkjet printer mainly lets the ink pass through the fine nozzle. Under the action of the heating pulse, the temperature of the heating element on the nozzle will accumulate and rise, so that the ink solvent near it will be vaporized to generate a large number of small bubbles. The volume of the bubbles within the heating time Continuously increasing, to a certain extent, the pressure generated will cause the ink to be ejected from the nozzle, and finally reach the surface of the substrate to reproduce the graphic information. [0003] Most of the existing bubble-type inkjet printheads use surface sacrificial layer technology to make the ink chamber, that is, a layer of sacrificial layer is first grown on the heating resistor by surface processing (such as electropl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/145B41J2/175B41J2/16
CPCB41J2/145B41J2/1601B41J2/1623B41J2/175
Inventor 陈婷婷马清杰王敏锐
Owner 苏州工业园区纳米产业技术研究院有限公司
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