Automatic setting system for setting testing probe height of wafer prober

Abstract

The invention discloses an automatic setting system for setting the testing probe height of a wafer prober. The system includes a control mainframe, a testing machine communication connecting apparatus, a testing machine head, a testing machine and probe card connecting apparatus, a probe card substrate, a prober, a wafer, a probe testing machine, and a probe testing machine communication connecting apparatus. The control mainframe is connected to the testing machine head through the testing machine communication connecting apparatus. The probe card is arranged on the probe card substrate and is connected to the testing machine head through the testing machine and probe card connecting apparatus. The probe testing machine is connected to the control mainframe through the probe testing machine communication connecting apparatus. A probe testing machine carrying wafer tray is fixed to a probe testing machine carrying wafer pedestal. A wafer is arranged on the probe testing machine carrying wafer tray. According to the invention, the automatic setting system can automatically set the testing probe height of the wafer prober, can easily find the wafer with the best probe testing probe heights, avoids differences of subjective judgment of setting workers, replaces detection prober trace with one-time button, is accurate, and can save time.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing equipment, in particular to an automatic setting system for setting wafer needle pressure. Background technique [0002] The production and manufacture of semiconductors has formed a perfect production process in the continuous development. Generally, it is integrated circuit design (in order to achieve certain functions, design a reasonable circuit)-wafer manufacturing (integrate the integrated circuit on the wafer through a special process)-wafer testing (integrate thousands of chips on the wafer) Tens of thousands of integrated circuit chips are functionally tested, and some chips with functional defects are eliminated) - Wafer cutting and grinding (cutting and removing chips that pass the functional test on the wafer) - Chip packaging (cutting and removing chips that have passed the functional test from the wafer) The chip is packaged to protect its circuit from the influe...

AI Technical Summary

Problems solved by technology

[0004] At present, the method of setting wafer needle pressure is mainly based on manual visual inspection. The manual visual method has differences in the subjective judgment of personnel, which is not accurate enough, and multiple manual inspections of needle marks will consume a lot of inspection time when the number of measurements is large.

As wafer bump technology becomes the new mainstream of chip interconnection, it is difficult to find the best test pin pressure with the existing manual visual method

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