Method for detecting the center of substrate, method for transporting a substrate, transporting unit and apparatus for treating a substrate including the unit

Abstract

A method for detecting a center of substrate, for transporting a substrate, a substrate transporting unit, and a substrate treating apparatus are provided. The substrate center detecting method includes detecting four edge positions of the substrate, judging whether a notch exists among the four edge positions or not, moving the substrate when there is a notch among the four edge positions, and calculating a center of the substrate, wherein the calculating includes re-detecting four edge positions of the substrate, calculating a first midpoint of the substrate using three edge positions out of the four edge positions of the substrate detected in the detecting, calculating a second midpoint of the substrate using three edge positions out of the four edge positions of the substrate detected in the re-detecting, and determining a real midpoint of the substrate based on moving status of the first and second midpoints of the substrate.

Description

technical field [0001] The present invention disclosed herein relates to a method for detecting the center of a substrate by detecting an edge position of the substrate, for a method based on a calculated positional misalignment amount of a substrate supported on a transport unit when the substrate is transported by the transport unit A method for transporting a substrate, a transport unit for transporting a substrate, and a substrate processing apparatus including the transport unit. Background technique [0002] The photolithography process in the semiconductor manufacturing process is used to form a desired pattern on a wafer. Typically, the photolithography process is performed by a spinner local device, which is connected to an exposure device and continuously performs a deposition process, an exposure process, and a development process. This spinner local device sequentially and selectively performs a deposition process, a baking process, and a development process. ...

AI Technical Summary

Problems solved by technology

However, the substrate midpoint calculated based on simultaneously detecting the position on the substrate and detecting the groove position becomes a midpoint different from the actual midpoint of the substrate, and it cannot be determined whether it is placed on the home point, And there is the problem of checking the amount of misalignment of the substrate and transporting the substrate

Images