Unlock instant, AI-driven research and patent intelligence for your innovation.
Method for manufacturing microscopic structural body
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology of a microstructure and a manufacturing method, which is applied in the manufacture of semiconductor/solid-state devices, the device for coating liquid on the surface, the photoengraving process of the pattern surface, etc., can solve the problems of long and complicated processes, and achieve simple manufacturing Effect
Inactive Publication Date: 2017-04-19
SOKEN CHEM & ENG CO LTD
View PDF12 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
However, the process is very long and complicated, and the conditions for making high-quality molds are very strict
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
no. 2 Embodiment approach
[0073] use Figure 4 ~ Figure 5 , and the second embodiment of the present invention will be described. This embodiment is similar to the first embodiment, and the main difference is that the first pattern 9 of the first mold 7 is not a fine-shaped pattern but a planar pattern (that is, a flat surface). Hereinafter, the difference will be mainly explained.
[0074] First, if Figure 4 As shown in (a) to (c), the first pattern 9 of the first mold 7 is pressed against the first transferred resin layer 5, and the first transferred resin layer 5 is irradiated with active energy rays 11 through the first mold 7. , from which it can be Figure 4 As shown in (c), the 1st cured resin layer 15 which has the 1st reverse pattern 9r which reversed the 1st pattern 9 is formed. Since the first pattern 9 is a planar pattern, the first reversed pattern 9r is also a planar pattern, and the surface of the first cured resin layer 15 is a flat surface.
[0075] Next, if Figure 5 As shown i...
no. 3 Embodiment approach
[0078] use Figure 6 , the third embodiment of the present invention will be described. This embodiment is similar to the first embodiment, and the main difference is that the second pattern 23 of the second mold 21 is not a fine-shaped pattern but a planar pattern (that is, a flat surface). Hereinafter, the difference will be mainly explained.
[0079] First, if figure 2 As shown in (a)-(c), the 1st cured resin layer 15 which has the 1st reverse pattern 9r of fine shape is formed by the method similar to 1st Embodiment.
[0080] Next, if Figure 6 As shown in (a) to (d), in the state where the second pattern 23 of the second mold 21 is pressed against the second transferred resin layer 25 on the first cured resin layer 15, the light-shielding pattern 3 is used as a mask. The second resin layer 25 to be transferred is irradiated with active energy rays 27 to cure the second resin layer 25 to be transferred in the non-shielding region, thereby forming the second cured resi...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Property
Measurement
Unit
thickness
aaaaa
aaaaa
thickness
aaaaa
aaaaa
thickness
aaaaa
aaaaa
Login to View More
Abstract
Provided is a method for manufacturing a microscopic structural body with which it is possible to easily produce a composite pattern and / or a nesting structure. The present invention provides a method for manufacturing a microscopic structural body, provided with a step for: forming a first cured resin layer onto which a first pattern of a first mold is transferred by emitting an active energy beam onto a first transfer resin layer through the first mold when the first pattern has been pushed against the first transfer resin layer, the first transfer resin layer being obtained by applying a first photo-curable resin composition onto a transparent base having a light-shielding pattern; and forming a second cured resin layer having an uneven shape including a low step part and a high step part by emitting an active energy beam onto a second transfer resin layer using the light-shielding pattern as a mask to cure a region that is a portion of the second transfer resin layer when a second pattern of a second mold is pushed against the second transfer resin layer, the second transfer resin layer being obtained by applying a second photo-curable resin composition onto the first cured resin layer, at least one of the first and the second patterns having a microscopic configuration.
Description
[0001] 【Technical field】 [0002] The present invention relates to a method of manufacturing a microstructure using imprinting technology. [0003] 【Background technique】 [0004] The imprint technique is a microfabrication technique in which a mold having a fine pattern is pressed against a resin layer such as liquid resin on a transparent substrate, thereby transferring the pattern of the mold to the resin layer to obtain a microstructure. As fine patterns, there are nanoscale patterns on the order of 10 nm to patterns on the order of 100 μm. The obtained microstructure can be used in various fields such as semiconductor materials, optical materials, storage media, micromachines, biology, and the environment. [0005] However, there are composite patterns and patterns in which fine shapes are nested as fine patterns formed in a fine structure. When such a pattern is produced using conventional techniques such as photolithography and electron beam lithography, the following ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More