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Circuit board and photoirradiation device using same

A wiring substrate and base substrate technology, applied to circuit substrate materials, printed circuit components, etc., can solve problems such as difficult soldering and solder heating of difficult-to-solder parts

Inactive Publication Date: 2017-04-19
CCS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, it is difficult to sufficiently heat the soldered part and the solder, and it is very difficult to perform soldering by hand

Method used

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  • Circuit board and photoirradiation device using same
  • Circuit board and photoirradiation device using same
  • Circuit board and photoirradiation device using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] One embodiment of the light irradiation device according to the present invention will be described below with reference to the drawings.

[0053] like figure 1 and figure 2 As shown, the light irradiation device 100 of the present embodiment includes: a wiring board 2 on which a plurality of LEDs 3 are mounted; and a case (holding body) 4 for accommodating the wiring board 2 . The light irradiation device 100 of this embodiment is a so-called ring lighting device. The light irradiation device 100 is applied to an appearance inspection system that takes an image of the workpiece illuminated by the light irradiation device 100 through the opening formed in the central part of the light irradiation device 100 through an imaging unit such as a CCD camera. Visual inspection of workpieces.

[0054] The case 4 includes: a main body 41 to which the wiring board 2 is fixed; and a cover (not shown) attached to the main body 41 and having a light transmission region for emitt...

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PUM

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Abstract

The present invention is a circuit board that uses a base substrate formed from metal, wherein electronic components can be easily welded manually. The circuit board comprises a base substrate (21) formed from metal and a wiring conductor layer (23) formed on a top surface (21a) of the base substrate (21) via an insulating layer (22). The wiring conductor layer (23) has an individual soldering region (R2) for soldering electronic components of external leads. Moreover, all of or a part of a portion (21X) of the base substrate (21) corresponding to the individual soldering region (R2) is removed.

Description

technical field [0001] The present invention relates to a wiring board in which a wiring conductor layer is formed on a metal base substrate via an insulating layer, and a light irradiation device using the wiring board. Background technique [0002] Conventionally, as a method of manufacturing an electronic circuit module, as shown in Patent Document 1, it is known to include, for example, a reflow process and a manual soldering process. The reflow soldering process is the following process: apply solder paste (cream solder) on the wiring board, place electronic components on it, heat the wiring board with a reflow furnace to melt the solder paste, and then cool and solder . In addition, the manual soldering process is a process of manually soldering electronic components that cannot be mounted in the reflow process. [0003] Here, an insulating substrate such as glass epoxy resin is generally used as the base substrate of the wiring board. Since such an insulating subst...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/05
CPCH05K1/02H05K1/05
Inventor 户川拓三森贵洋
Owner CCS INC