Transfer system and transfer method of microelements, manufacturing method, device and electronic device

A transfer system and transfer method technology, applied in the field of electronic equipment

Active Publication Date: 2017-04-26
XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One of the difficulties in the fabrication of microcomponents is how to tran

Method used

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  • Transfer system and transfer method of microelements, manufacturing method, device and electronic device
  • Transfer system and transfer method of microelements, manufacturing method, device and electronic device
  • Transfer system and transfer method of microelements, manufacturing method, device and electronic device

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Embodiment Construction

[0064] Embodiments of the present invention describe a transfer system for transferring a micro-element and a method for transferring a micro-element array using the transfer system. Among them, the micro-element array can be micro-LED devices, diodes, transistors, integrated circuit (IC) chips, etc., and its size can be 1-5000 μm, but it is not necessarily limited thereto, and some aspects of the embodiment can be applied to larger and larger smaller size.

[0065] The transfer system has a main picker for picking up or releasing micro components, the main picker has a series of arrays of picker units, each picker unit has a size (eg length or width) of 1 to 5000 μm, for example 10 to 100 μm, or 100 ~500 microns, or 1000 ~5000 microns. The transfer system is also provided with a test device, which has a test circuit and a test platform. A series of test electrodes are arranged on the surface of the test platform. The electrode of the component is in contact with the test el...

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Abstract

The present invention provides a transfer system and transfer method of microelements, a manufacturing method, a device and an electronic device. The transfer system of the microelements comprises a main pick-up device, a test device, a first carrying disc and a second carrying disc; the main pick-up device is used for picking up or releasing the microelements; the test device is provided with a test platform and a series of test circuits; the surface of the platform is provided with a series of test electrodes which are connected with the test circuits; the first carrying disc is used for carrying an original microelement array; and the second carrying disc is used for carrying a receiving substrate. When the transfer system is adopted to transfer the microelements, the main pick-up device is adopted to pick up the microelements and move the microelements to the platform of the test device; the test device is adopted to test the microelements; and qualified microelements picked up by the main pick-up devices are released onto the receiving substrate according to test results.

Description

technical field [0001] The present invention relates to a micro-element for display, and more particularly, to a transfer device, a transfer method, a manufacturing method, a device and an electronic device for a micro-element. Background technique [0002] Micro-component technology refers to an array of micro-sized components integrated at high density on a substrate. At present, micro-pitch light-emitting diode (Micro LED) technology has gradually become a research hotspot, and the industry expects high-quality micro-component products to enter the market. High-quality fine-pitch light-emitting diode products will have a profound impact on traditional display products such as LCD / OLED that are already on the market. [0003] In the process of fabricating microcomponents, the microcomponents are first formed on a donor substrate and then transferred to a receiving substrate. The receiving substrate is, for example, a display screen. One difficulty in the fabrication of ...

Claims

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Application Information

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IPC IPC(8): H01L21/677B81C1/00B81C3/00
CPCH01L21/67763B81C1/00015B81C1/00349B81C3/008H01L22/12H01L22/14H01L22/20H01L21/6835H01L2221/68368H01L2221/68354H01L2221/68322H01L2221/68381B81C99/002H01L21/67259H01L21/6838H01L22/34G01R31/00
Inventor 徐宸科邵小娟郑建森梁兴华其他发明人请求不公开姓名
Owner XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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