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Test plate mold pressing mold

A technology for testing boards and molds, used in household appliances, other household appliances, household components, etc., can solve problems such as poor safety, mold air leakage, and heavy weight, and achieve weight reduction and complexity, workload reduction, and easy operation. Effect

Inactive Publication Date: 2017-05-10
HENGSHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a test plate molding die to solve the problem in the prior art that the upper platen of the press cannot be completely in contact with the upper die due to the glue injection port being arranged on the lower die of the die, resulting in deformation of the die and leakage of the die. Gas, product accuracy cannot be guaranteed, the mold structure using oil heating method is more complicated, the weight is heavy, the oil circuit design is cumbersome, and auxiliary equipment such as mold temperature controller is needed, and the safety is poor.

Method used

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  • Test plate mold pressing mold

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Embodiment

[0021] A test board molding die, including an upper mold 2, a lower mold 3, an upper electric heating plate 1, a lower electric heating plate 4 and a positioning assembly, the upper mold 2 and the lower mold 3 form a closed cavity, and the lower mold 3 is along the length There are glue injection ports 6 on both sides of the direction, and the glue injection ports 6 are connected to the closed chamber. The upper mold 2 is fixed on the upper electric heating plate 1 of the press through the pressing plate, and the lower mold 3 is set on the lower electric heating plate 4 of the press. On the upper side, the positioning assembly adopts an L-shaped positioning structure. The positioning assembly includes an upper positioning block 7 and a lower positioning block 8. The lower mold 3 is provided with an upper positioning block 7 along the lengthwise side and a widthwise side respectively, and the lower electric heating plate 4 is molded along the The side in the length direction and...

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Abstract

The invention provides a test plate mold pressing mold which comprises an upper mold, a lower mold, an upper electric heating plate, a lower electric heating plate and a positioning component. The upper mold and the lower mold form a closed cavity, glue injection ports are formed in two side surfaces of the lower mold along the length direction of the lower mold and communicated with the closed cavity, the upper mold is fixed onto the upper electric heating plate of a press through a pressing plate, the lower mold is arranged on the lower electric heating plate of the press, and the positioning component is of an L-shaped positioning structure. The test plate mold pressing mold is simple in structure and convenient to operate and solves the problems that the mold is deformed, complex in structure, heavy and inconvenient to operate and clean and leaks air, and product accuracy cannot be ensured. Time and labor are saved, and batch production of test plates is achieved on the premise of simplifying process operation.

Description

technical field [0001] The invention relates to a test board molding die. Background technique [0002] RTM is the abbreviation of Resin Transfer Moulding. RTM process is generally used for the production of composite parts with complex profiles and high requirements for all surface quality. It is a low-cost liquid molding technology that does not use prepreg. Five processes such as mould, etc. complete the production of parts. Because the RTM process has the characteristics of high production efficiency, high manufacturing precision, good surface quality, and the ability to directly form complex and shaped products, it has been more and more widely used in aerospace, rail transportation and other fields. [0003] Since the RTM test board has a variety of thicknesses, in the test board molding die, the thickness of the mold can be quickly changed, thereby changing the thickness of the product, and achieving the purpose of mass production and high-efficiency production of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C70/48B29C70/54B29C45/73B29L31/30
CPCB29C70/48B29C45/73B29C70/54B29L2031/30
Inventor 刘瑞东於永红李祥侯淑玲
Owner HENGSHEN
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