Flexible composite circuit board and fabrication method thereof

A composite circuit and circuit board technology, which is applied in the direction of circuit substrate materials, multilayer circuit manufacturing, printed circuits, etc., can solve the problems of poor flexibility and bending resistance of flexible composite circuit boards, so as to improve bending resistance and solve the problem of flexibility. performance and durability

Pending Publication Date: 2017-05-10
长沙牧泰莱电路技术有限公司
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  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a flexible composite circuit board and a manufacturing method thereof, which can improve the flexibility of the flexible composite circuit board by providing multiple flexible layers and reducing the covering layer between the flexible layers, thereby improving the flexibility of the flexible composite circuit board. The bending resistance of the composite circuit board, while ensuring that its function can be realized normally; to solve the technical problems of the existing flexible composite circuit board's poor flexibility and bending resistance

Method used

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  • Flexible composite circuit board and fabrication method thereof
  • Flexible composite circuit board and fabrication method thereof
  • Flexible composite circuit board and fabrication method thereof

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Embodiment Construction

[0043] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced.

[0044] Please refer to figure 1 , figure 1 It is a structural schematic diagram of a preferred embodiment of the flexible composite circuit board of the present invention. The flexible composite circuit board 20 of this preferred embodiment includes a flexible layer I 21 , a flexible layer II 22 , a flexible layer III 23 and a cover layer 24 . The outer side of the flexible layer I21 is provided with a surface circuit I211; the outer side of the flexible layer II22 is provided with a surface circuit II221; the flexible layer III23 is arranged between the flexible layer I21 and the flexible layer II22, and the surface of the flexible layer III23 is provided with an inner layer circuit 231; the covering layer 24 are provided outside the surface circuit I 211 and outside the surface circuit II 221 ....

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Abstract

The invention relates to a flexible composite circuit board and a fabrication method thereof. The flexible composite circuit board comprises a first flexible layer, a second flexible layer, a third flexible layer, a binding layer and a through hole copper layer, wherein a first surface circuit is arranged at an outer side of the first flexible layer, a second surface circuit is arranged at an outer side of the second flexible layer, the third flexible layer is arranged between the first flexible layer and the second flexible layer, and an inner-layer circuit is arranged on a surface of the third flexible layer. In the flexible composite circuit board, multiple flexible layers are arranged, a coverage layer among the flexible layers is reduced, the flexibility of the flexible composite circuit board is improved, so that the bending resistance of the flexible composite circuit board is improved.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a flexible composite circuit board and a production method thereof. Background technique [0002] The traditional printed circuit board (PCB, Printed Circuit Board) is made of hard board material, which is composed of epoxy resin, glass fiber cloth and copper foil. Rigid performance, can play a good role in supporting and fixing during welding and installation. However, general printed circuit boards are rigid printed circuit boards, and can only be connected two-dimensionally, that is, the connection is completed on the surface of the printed circuit board. Communication, so the space requirements for electronic products are high. [0003] Therefore, it is necessary to provide a flexible composite circuit board to solve the problems existing in the prior art. Contents of the invention [0004] The purpose of the present invention is to provide a flexible composite ci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/03H05K3/46
CPCH05K1/028H05K1/0393H05K3/46H05K2201/0195
Inventor 黄孟良喻智坚
Owner 长沙牧泰莱电路技术有限公司
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