Method and apparatus for slicing and viewing samples
A kind of equipment and slicing technology, applied in the direction of using wave/particle radiation for material analysis, discharge tube, instrument, etc., can solve the problems of lack of flatness, non-flat surface, and reduced resolution
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[0030] In the following discussion and in the claims, the terms "comprises" and "comprises" are used in an open fashion, and thus should be construed to mean "including but not limited to". To the extent any term is not specifically defined in this specification, it is intended that the term be given its plain and ordinary meaning. Furthermore, use of the term "and / or" herein should be read as an "inclusive" or rather than an "exclusive" or. For example, the phrase "A and / or B" as used herein will mean "A, B, or A and B." As another example, as used herein, the phrase "A, B, and / or C" would mean "A, B, C, or any combination thereof." Furthermore, whenever the terms "automatic," "automated," or similar terms are used herein, those terms will be understood to include manual initiation of automatic or automated processes or steps.
[0031] As used herein, the terms "milling" and "etching" refer to the removal of sample material, and the terms "sectioning", "slicing milling" and...
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