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Aging-resistant and heat-conducting silicone material for computer processor and preparation method of silica gel material

A computer processor and thermally conductive silica gel technology, applied in the field of thermally conductive silica gel, can solve the problems of reduced thermal conductivity, affecting the normal heat dissipation of computer processors, and prone to aging, so as to achieve the phenomenon of not aging easily, facilitate wide-scale promotion and use, and ensure thermal conductivity. Effect

Inactive Publication Date: 2017-05-17
QUFU NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing heat-conducting silica gel is prone to aging during long-term use, resulting in a decrease in thermal conductivity and affecting the normal heat dissipation of the computer processor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] An aging-resistant thermally conductive silica gel material for a computer processor, made of the following raw materials in parts by weight: 45 parts of divinyl silicone oil, 4 parts of vinyltrimethoxysilane, 5 parts of aluminum powder, 12 parts of copper powder, 2 parts of magnesium oxide 1 part, 1 part of sodium sulfate, 7 parts of polymethylhydrogen siloxane, 3 parts of titanium dioxide, 6 parts of bispyrrolidone silane, 5 parts of pentaerythritol, 1 part of vulcanizing agent, and 1 part of chloroplatinic acid.

[0023] In this embodiment, the preparation method of the aging-resistant thermally conductive silica gel material for the computer processor has the following steps:

[0024] 1) Weighing aluminum powder, copper powder, magnesium oxide, titanium dioxide, combined, ball milling and mixing for 2 hours to obtain ball milling material;

[0025] 2) Weigh divinyl silicone oil and vinyltrimethoxysilane, add them to an internal mixer, stir and mix at 80°C for 20 min...

Embodiment 2

[0033] An aging-resistant thermally conductive silica gel material for a computer processor, made of the following raw materials in parts by weight: 46 parts of divinyl silicone oil, 5 parts of vinyltrimethoxysilane, 6 parts of aluminum powder, 16 parts of copper powder, and 4 parts of magnesium oxide 2.8 parts of sodium sulfate, 8 parts of polymethylhydrogen siloxane, 4 parts of titanium dioxide, 9 parts of bispyrrolidone silane, 8 parts of pentaerythritol, 1.3 parts of vulcanizing agent, and 1.7 parts of chloroplatinic acid.

[0034] In this embodiment, the preparation method of the aging-resistant thermally conductive silica gel material for the computer processor has the following steps:

[0035] 1) Weighing aluminum powder, copper powder, magnesium oxide, titanium dioxide, combined, ball milling and mixing for 2.5 hours to obtain ball milling material;

[0036] 2) Weigh divinyl silicone oil and vinyltrimethoxysilane, add them to an internal mixer, stir and mix at 81°C for...

Embodiment 3

[0044] An aging-resistant thermally conductive silica gel material for a computer processor, made of the following raw materials in parts by weight: 49 parts of divinyl silicone oil, 6 parts of vinyltrimethoxysilane, 7 parts of aluminum powder, 15 parts of copper powder, and 3.5 parts of magnesium oxide 1.9 parts of sodium sulfate, 8.6 parts of polymethylhydrogen siloxane, 5 parts of titanium dioxide, 8 parts of bispyrrolidone silane, 7 parts of pentaerythritol, 2.1 parts of vulcanizing agent, and 1.4 parts of chloroplatinic acid.

[0045] In this embodiment, the preparation method of the aging-resistant thermally conductive silica gel material for the computer processor has the following steps:

[0046] 1) Weigh aluminum powder, copper powder, magnesium oxide, titanium dioxide, after combining, ball mill and mix for 3.5h to obtain ball mill;

[0047] 2) Weigh divinyl silicone oil and vinyltrimethoxysilane, add them to an internal mixer, stir and mix at 83°C for 25 minutes, an...

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PUM

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Abstract

The invention discloses an aging-resistant and heat-conducting silicone material for a computer processor. The silicone material is prepared from raw materials in parts by weight as follows: 45-52 parts of divinyl silicone oil, 4-8 parts of vinyl trimethoxysilane, 5-9 parts of aluminum powder, 12-17 parts of copper powder, 2-5 parts of magnesium oxide, 1-3 parts of sodium sulfate, 7-10 parts of polymethylhydrosiloxane, 3-7 parts of titanium dioxide, 6-10 parts of dipyrrolidone silane, 5-9 parts of pentaerythritol, 1-3 parts of a vulcanizing agent and 1-2 parts of chloroplatinic acid. The invention further discloses a preparation method of the aging-resistant and heat-conducting silicone material for the computer processor. The prepared heat-conducting silicone material has a good heat conducting property, has excellent aging resistance, cannot age easily when used in the high-temperature environment for a long time, and guarantees normal heat dissipation of the computer processor.

Description

technical field [0001] The invention relates to the technical field of heat-conducting silica gel, in particular to an aging-resistant heat-conducting silica gel material for a computer processor and a preparation method thereof. Background technique [0002] A computer processor is the functional unit that interprets and executes instructions, also known as the central processing unit or cpu, which is the central nervous system of a computer, in contrast to the devices surrounding the processor and memory called peripherals, such as keyboards, monitors, Disks, tape drives, etc. are peripherals. Each processor has a unique set of operation commands, which can be called the instruction set of the processor, such as storage, transfer, etc. are all operation commands. [0003] Computer processors will generate a lot of heat during work. If the heat dissipation measures are not proper, the temperature of the components will be too high, resulting in a decrease in its working pe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/02C08K5/5425C08K3/08C08K3/22C08K3/30C09K5/14
CPCC08L83/04C08L2203/20C08L2205/025C09K5/14C08K13/02C08K5/5425C08K2003/0812C08K2003/085C08K2003/222C08K2003/3045
Inventor 张景虎
Owner QUFU NORMAL UNIV
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