Wiring body, wiring substrate, touch sensor, and manufacturing method of wiring body

Abstract

The invention provides a wiring body. The wiring body (1) is equipped with: an adhesive layer (3); and a conductor pattern (41) bonded to the adhesive layer (3), and an adhesive bonded to the adhesive layer (3) in the conductor pattern (41) The surface roughness of the surface (42) is larger than the surface roughness of other surfaces of the conductive pattern (41) except the adhesive surface (42).

Description

technical field [0001] The present invention relates to a wiring body, a wiring substrate, a touch sensor, and a method for manufacturing the wiring body. [0002] With regard to the designated countries that have accepted the incorporation by reference of documents, the content described in Japanese Patent Application No. 2014-264492 filed in Japan on December 26, 2014 is incorporated by reference into this specification, and it is used as the content described in this specification. part. Background technique [0003] There is known a conductive wiring pattern formed by filling a gravure plate with a conductive material, transferring the conductive material to a substrate to be transferred using an offset printing method, and passing through a subsequent heating process (for example, refer to Patent Document 1). [0004] In addition, as an electromagnetic wave shielding material, there is known a material in which a plate having recesses of a predetermined pattern filled ...

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that light incident from the outside is diffusely reflected on the surface of the conductor wiring pattern.

On the other hand, even if the surface roughness of the entire conductive wiring pattern can be reduced to suppress the diffuse reflection, there is a problem that it is difficult to firmly bond the conductive material and the substrate.

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