Micro-channel heat exchanger with multiple flow path interconnection structures and method for manufacturing micro-channel heat exchanger

Abstract

The invention provides a micro-channel heat exchanger with multiple flow path interconnection structures and a method for manufacturing the micro-channel heat exchanger. The micro-channel heat exchanger comprises a metal micro-channel substrate. The substrate is provided with a plurality of open circular ring structures which are parallelly arranged along the flow direction of cooling liquid and are distributed to form arrays, each open circular ring structure comprises four outer first arc-shaped fins and two inner second arc-shaped fins, the four first arc-shaped fins of each open circular ring structure are circumferentially uniformly arranged at intervals, and the two second arc-shaped fins of each open circular ring structure are symmetrically arranged, so that large open circular rings and small open circular rings which are nested in the large open circular rings can be formed. A front slit, a rear slit, an upper slit and a lower slit are respectively formed by each large open circular ring in the directions parallel and perpendicular to the flow direction of the cooling liquid, a front slit and a rear slit are formed by each small circular ring in the directions parallel to the flow direction of the cooling liquid, and multiple flow path interconnection channels are formed by the slits. The method includes processing multiple flow path interconnection micro-channel structures by the aid of laser milling technologies; packaging upper cover plates by the aid of heat-resistant glass to obtain the micro-channel heat exchanger. The micro-channel heat exchanger and the method have the advantages that processes for manufacturing the micro-channel heat exchanger are simple, the micro-channel heat exchanger and the method are low in cost, and boundary layers can be destructed, so that micro-channel heat exchange can be enhanced.

Description

technical field [0001] The invention relates to a microchannel heat exchanger and a manufacturing method thereof, in particular to a microchannel heat exchanger with multi-flow path interconnection and a manufacturing method thereof. Background technique [0002] With the rapid development of the microelectronics industry, various related products are developing towards the direction of high speed integration and miniaturization. During the working process of high-density integrated circuits, if the heat generated is not taken away in time, the temperature rise will inevitably Affects normal. In order to ensure the stable and reliable operation of microelectronic products, heat exchangers are required to have the characteristics of small size, light weight, suitable for compact packaging, and high heat dissipation performance. Microchannel heat exchangers have emerged as the times require. The traditional microchannel heat exchanger mainly uses metal or silicon as the subst...

AI Technical Summary

Problems solved by technology

When the thermal boundary layer has not yet reached the fully developed area, the heat transfer coefficient is relatively large and the heat transfer performance is relatively good, but as the flow expands, the heat transfer coefficient drops rapidly, resulting in a significant decrease in heat transfer performance and enhanced heat transfer effect very limited

In addition, because the cross-sectional area of ​​these traditional parallel microchannel structures is consistent along the flow direction, when the two-phase boiling forms bubbles, the pressure in the middle of the channel will be high, driving the bubbles to flow upstream, resulting in backflow, resulting in Serious boiling instability problem seriously endangers the stable operation of the microchannel heat exchanger

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