Wide-temperature heat control device

Abstract

The invention relates to a wide-temperature heat control device, and belongs to the technical field of electrical equipment. The combination of a phase-change material and a heat transfer technique is adopted for the device provided by the invention. The wide-temperature heat control device mainly comprises an outer shell, a heat insulating layer, an inner shell, a phase-change heat conducting cushion, a heat conducting block, a composite organic phase-change material, a heat diode and a heat radiating fin. A pure physical way is adopted for the device provided by the invention to carry out heat control; the addition of extra equipment (a fan, a heating wire and the like) is not needed; the addition of extra energy is not needed; the problem of the non-mandatory heat radiation of electronic equipment in a wide-temperature environment can be solved. The device provided by the invention is typically applied to an explosive environment; mandatory heat control measures of an axial fan, the heating wire and the like are inappropriately adopted in the explosive environment, as a potential safety hazard is possibly generated in a failure condition; however, the wide-temperature heat control device provided by the invention has no an extra heat load, is high in reliability, has no the potential safety hazard, and can be used for resisting the influences of a high temperature and a low temperature of a large-space environment on the electronic equipment.

Description

technical field [0001] The invention relates to a wide-temperature thermal control device, in particular to the thermal structure design of safety production monitoring and monitoring equipment (gas infrared leak detector, spark detector, camera, etc.) in wide-temperature working conditions through photoelectric conversion, belonging to General Electric equipment technology field. Background technique [0002] As we all know, electronic equipment is extremely sensitive to the temperature requirements of the working environment. Too high or too low ambient temperature will affect the normal operation of the electronic equipment, and even damage the electronic equipment. At present, the most commonly used methods for heating or dissipating heat from electronic devices are one or a combination of cooling fins, heating wires, forced convection cooling with fans, and liquid cooling. However, in most applications, there are requirements on the cost, structure, volume, etc. of the...

AI Technical Summary

Problems solved by technology

However, in most applications, there are requirements on the cost, structure, volume, etc. of the equipment, and even some special occasions (such as explosive environments) require no additional energy. Require

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