Parallel plate inline substrate processing tool

Abstract

In some embodiments, an inline substrate processing tool may include a substrate carrier having a plurality of slots configured to retain a plurality of substrates parallel to each other when disposed in the slots, a first substrate processing module and a second substrate processing module disposed in a linear arrangement, wherein each substrate processing module includes an enclosure and a track that supports the substrate carrier and provides a path for the substrate carrier to move linearly through the first and second substrate processing modules, and a first gas cap disposed between the first and second substrate processing modules, wherein the first gas cap includes a first process gas conduit to provide a first process gas to the first substrate processing module, and a second process gas conduit to provide a second process gas to the second substrate processing module.

Description

technical field [0001] Embodiments of the present disclosure generally relate to semiconductor processing equipment. Background technique [0002] Amorphous and polycrystalline solar cells are limited in their efficiency in converting light into energy. Single crystal high mobility materials can have much higher efficiencies, but are also generally much more expensive. Conventional devices are designed for semiconductor applications with extreme specifications and very high cost. However, these systems all have high costs and cannot be automated for high throughput. [0003] In order to achieve very low-cost epitaxial deposition for photovoltaic applications at high throughput, the inventors believe that changes beyond simply making everything bigger are needed. For example, the inventors have observed that single batch reactors are limited in throughput, while also having high material, consumable costs, and automation challenges. Very high flows of hydrogen, nitrogen, ...

AI Technical Summary

Problems solved by technology

The main problem is poor membrane quality, which the inventors believe is due to isolation between chambers, metal contamination during the process, and excessive maintenance

[0005] On the other hand, single-wafer reactors are extremely inefficient in utilizing precursors and power (electricity), and have lower yields per wafer

Additionally, single wafer reactors require complex substrate handling mechanisms

Thus, while single wafer reactors can have very high quality, low metal contamination levels, and good thickness uniformity and resistivity, the cost per wafer to achieve these results can be very high

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