Organic silicon electronic pouring sealant for flame retardant heat conduction PCB (printed circuit board)

Abstract

The invention discloses an organic silicon electronic pouring sealant for a flame retardant heat conduction PCB (printed circuit board). The organic silicon electronic pouring sealant is prepared from the following raw materials in parts by weight: 40 to 50 parts of vinyl-terminated silicone oil-1, 50 to 60 parts of vinyl-terminated silicone oil-2, 0.38 to 0.5 part of 12-percent platinum catalysts, 0.02 to 0.04 part of ethynyl cyclohexanol, 25 to 30 parts of vinyl silicone resin, 14.8 to 16.8 parts of 1-allyloxy-2,3-epoxy propane, 23 to 25 parts of 1,3,5,7-tetramethyl cyclotetrasiloxane, 2.7 to 3.6 parts of silane coupling agents A171, a proper amount of hydrogen-containing silicone oil, 4 to 5 parts of quartz powder, 2 to 3 parts of aluminum hydroxide, 0.3 to 0.5 part of titanate coupling agents TC114 and 0.3 to 0.4 part of silane coupling agents KH560. The prepared pouring sealant has the advantages that the curing time is short; the viscosity is stable; the intensity is high; the anti-corrosion performance and the flame retardant performance are good; the production process is stable; the operability is high; the pouring sealant is suitable for large-scale production.

Description

technical field [0001] The invention relates to the technical field of potting glue for printed circuit boards, in particular to a silicone electronic potting glue for flame-retardant and heat-conducting PCB circuit boards. Background technique [0002] With the rapid development of electronic science and technology, electronic components, devices, instruments and meters have been widely used in the electronic industry. Since the working environment of many electronic devices is complex and changeable, and sometimes even encounters extremely harsh natural conditions, in order to protect electronic components and integrated circuits from the working environment and improve the electrical performance and stability of electronic devices, it is necessary to The device is potted for protection. Potting is one of the important processes in the assembly of electronic devices. It is to fill the gaps of electronic devices with potting materials by mechanical or manual methods, and p...

AI Technical Summary

Problems solved by technology

However, the potting compound synthesized in this article can not meet the requirements of the potting compound on the market fo