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Wafer-pickup control system and method

A technology of control system and control method, which is applied in the fields of semiconductor/solid-state device manufacturing, electrical components, semiconductor/solid-state device testing/measurement, etc. The effect of a small pull

Active Publication Date: 2017-05-31
CETC BEIJING ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the problem of low yield of finished wafers in the prior art due to the unreasonable picking-up method and unreasonable timing sequence of the unloading manipulator, the implementation of the present invention provides a wafer picking-up control System and method

Method used

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  • Wafer-pickup control system and method

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Embodiment 1

[0050] According to an aspect of the embodiments of the present invention, a control system for wafer pickup is provided, such as figure 1 As shown, the control system includes:

[0051] The sheet-taking device, the sheet-taking device comprises a fixing part 101, a lower film manipulator 102 installed on the fixing part 101, a rotating link 103 connected with the lower film manipulator 102, and a lifting slider 104;

[0052] A detection device arranged on the fixing member 101 for detecting whether the unloading manipulator 102 has reached a preset reference position;

[0053] Drive the rotating connecting rod 103 to rotate to drive the first driving device 2 that the lower manipulator 102 rotates on the same horizontal plane;

[0054] Driving the lifting slide block 104 to slide to drive the second driving device 3 of the lower manipulator 102 to lift up and down in the vertical direction;

[0055] A control device electrically connected to the detection device, the first ...

Embodiment 2

[0073] According to another aspect of the embodiments of the present invention, there is also provided a method for controlling wafer pickup, which is applied to the control system for wafer pickup as described in Embodiment 1. The control method includes:

[0074] Detect whether the unloading manipulator 102 reaches the preset reference position;

[0075] If the detection result is yes, then when the lower sheet manipulator 102 reaches the preset reference position, control signals are sent to the first driving device 2 and the second driving device 3 respectively, and the first driving device 2 and the second driving device 3 are controlled to work to drive The unloading manipulator 102 arrives at a plurality of preset stations in sequence to take the film.

[0076] Wherein, when the unloading manipulator 102 is in the first station, a layer of water film is formed between the wafer and the wafer table 4, and when the unloading manipulator 102 moves from the second station t...

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Abstract

The invention provides a wafer-pickup control system and method. The control system comprises a wafer-pickup apparatus, a detection apparatus, a first driving apparatus, a second driving apparatus, and a control apparatus, wherein the wafer-pickup apparatus comprises a fixed part, a wafer-pickup mechanical arm mounted on the fixed part, a rotary connecting rod connected with the wafer-pickup mechanical arm, and a lifting sliding block; the detection apparatus is used for detecting whether the wafer-pickup mechanical arm reaches a preset reference position or not; the first driving apparatus is used for driving the rotary connecting rod to turn to drive the wafer-pickup mechanical arm to rotate; the second driving apparatus is used for driving the lifting sliding block to slide to drive the wafer-pickup mechanical arm to go up and down; the control apparatus is electrically connected with the detection apparatus, the first driving apparatus and the second driving apparatus; and the control apparatus is used for transmitting control signals to the first driving apparatus and the second driving apparatus respectively when the wafer-pickup mechanical arm reaches the preset reference position, so as to drive the wafer-pickup mechanical arm to reach multiple preset stations in sequence to pick up wafers. By adoption of the control system, downward pulling force to a wafer by a water film below can be reduced in the wafer pickup process, so that the wafer is not cracked in the pickup process, and the success rate of finished wafer pickup is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a control system and method for picking up wafers. Background technique [0002] During the wafer grinding process, because the wafer is thin and fragile, it is necessary to use the unloading robot to take the wafer. However, in the control system of the automatic wafer thinning machine, the way of picking up the unloading manipulator and the timing of picking up the slices are a key issue to ensure the smooth transportation of the wafers. It can be seen from this that the method of picking up the wafer by the unloading manipulator and the timing of picking up the wafer directly affect the yield of finished wafer grinding. Contents of the invention [0003] In order to overcome the problem of low yield of finished wafers in the prior art due to the unreasonable picking-up method and unreasonable timing sequence of the unloading manipulator, the implementation of the pre...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/66
CPCH01L21/67742H01L21/67745H01L22/12H01L22/26
Inventor 白阳杨生荣衣忠波刘宇光李远航梁津姚立新
Owner CETC BEIJING ELECTRONICS EQUIP