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LED lamp photoelectric composite packaging method

A packaging method and technology of LED lamp beads, which are applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of frequent rework, low efficiency, waste of raw materials, high cost, low brightness display, etc., and achieve better brightness display effect. The effect of high rework efficiency and simple operation

Inactive Publication Date: 2017-05-31
厦门天微电子有限公司
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AI Technical Summary

Problems solved by technology

[0003] In order to solve the above-mentioned problems of low yield rate, low efficiency of frequent rework, waste of raw materials, high cost, and low brightness display in the prior art, the present invention adopts the following technical solutions:

Method used

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Embodiment Construction

[0006] Preferred embodiments of the present invention will be described in detail below.

[0007] A kind of LED light electric compound packaging method, comprises the following four steps, a front LED light bead solid crystal bonding wire takes an LED metal bracket, sticks a layer of protective film on the reverse side of the LED metal bracket, and carries out the LED light on the front side of the LED metal bracket. The beads are solidified and connected by welding wires. One LED metal bracket is used to fix multiple LED lamp beads; the second LED lamp beads are plastic-sealed on the front of the LED metal bracket to plastic-seal the LED lamp beads, and the plastic packaging is made of transparent epoxy resin; Driver chip die-bonding plastic packaging and flash removal Remove the protective film on the back of the LED metal bracket, and then fix the driver chip on the back of the LED metal bracket and solder the wires. The number of driver chips is exactly the same as the num...

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PUM

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Abstract

The invention discloses an LED lamp photoelectric composite packaging method. The method comprises four steps of LED bead die-bonding and wire-bonding, LED bead plastic packaging, driving chip die-bonding and plastic-packaging, flash removing and finished product tendon cutting, wherein the bead and the driving chip are respectively bonded on front and back surfaces of a bracket, and are subjected to plastic package through epoxy resin. According to the method, the operation is simple, the yield is high, frequent reworking requirement is not needed, the efficiency is high, and the brightness display effect is relatively good since the chip does not influence luminescence and irradiation of the bead.

Description

technical field [0001] The invention belongs to the field of LED lamp packaging, in particular to a photoelectric composite LED lamp packaging method. Background technique [0002] . LED lights mainly include lamp beads and driver chips. Both of them need to be fixed on the metal bracket when packaging. In the current LED lamps, the lamp beads and driver chips are packaged together. The packaged products are easy to operate. , high efficiency, low labor cost, but there are other defects, the yield rate of the two packaged together is low, the brightness of the LED lamp bead display is low, frequent rework and maintenance are required, there is a lot of waste of raw materials and high cost, and the use of low brightness is very inconvenient. If If there is a packaging method that can improve the yield rate and display brightness, and can also take into account production efficiency, the above-mentioned problems can be easily solved. Contents of the invention [0003] In o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/00H01L33/48H01L33/62
CPCH01L33/62H01L25/075H01L33/005H01L33/48
Inventor 门洪达
Owner 厦门天微电子有限公司
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