Baseplate assembly, display baseplate mother board, display baseplate and preparation method thereof, and display

A technology for substrates and components, applied in the fields of display substrates and their preparation, displays, display substrate motherboards, and substrate components, can solve the problems of rigid substrates that cannot be recycled, polymer stability decline, and increased costs.

Active Publication Date: 2017-05-31
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the separation method of the rigid substrate and the flexible substrate mainly adopts physical separation, but the physical separation is easy to damage the rigid substrate and the flexible substrate, which makes the rigid substrate unable to be recycled, increases the cost, and reduces the flexible display. Substrate pass rate
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  • Baseplate assembly, display baseplate mother board, display baseplate and preparation method thereof, and display
  • Baseplate assembly, display baseplate mother board, display baseplate and preparation method thereof, and display
  • Baseplate assembly, display baseplate mother board, display baseplate and preparation method thereof, and display

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] An embodiment of the present invention provides a substrate assembly, such as figure 1 As mentioned above, it includes the carrier substrate 10 and the connection layer 20 and the flexible substrate 30 sequentially formed on the carrier substrate 10. The material of the connection layer 20 is mainly composed of organic layered materials, and the molecular structure of the organic layered materials includes hydrophilic sexual group.

[0033] It should b...

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Abstract

The embodiment of the invention provides a baseplate assembly, a display baseplate mother board, a display baseplate and a preparation method thereof, and a display, and relates to the technical field of flexible display. Breakage can be avoided when a bearing baseplate and a flexible substrate baseplate are separated, and the heave phenomenon of a connecting layer at high temperature can be avoided. The baseplate assembly comprises the bearing baseplate, and the connecting layer and the flexible substrate baseplate which are formed on the bearing baseplate sequentially. The connecting layer is mainly made of an organic layered material, and the molecular structure of the organic layered material comprises a hydrophilic group. The baseplate assembly is used for manufacturing a flexible display baseplate.

Description

technical field [0001] The invention relates to the technical field of flexible display, in particular to a substrate assembly, a display substrate mother board, a display substrate and a preparation method, and a display. Background technique [0002] With the development of science and technology, the field of display technology is changing with each passing day, and there are more and more types of displays, such as liquid crystal displays (Liquid Crystal Display, LCD for short), organic light-emitting diode displays (Organic Light-Emitting Diode, OLED for short), electrophoretic displays etc. These displays can be divided into rigid displays and flexible displays according to whether they are easy to be bent. Among them, the flexible display has become a good portable product because it can be rolled, folded, or even worn, and is increasingly favored by consumers. [0003] The preparation method of the flexible display substrate mainly includes: first providing a rigid ...

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Application Information

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IPC IPC(8): H01L51/50H01L51/56
CPCH10K50/00H10K71/00H05K3/007Y02E10/549Y02P70/50H10K71/80H10K59/12H10K77/111H10K59/1201H10K50/844H05K1/0393H05K1/189H05K1/056
Inventor 贾文斌孙力许名宏
Owner BOE TECH GRP CO LTD
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