Double-cavity-layer combiner and public port device thereof

Abstract

The invention discloses a double-cavity-layer combiner and a public port device thereof. The public port device is characterized in that a first division plate is arranged in a shell and used for dividing the shell into a first cavity layer and a second cavity layer, and a second division plate is arranged on the first division plate and used for separating the first cavity layer into a first cavity 1 and a first cavity 2. A public joint hole connected with a public joint is formed in the shell, a coupling window is concavely arranged on a side, opposite to the public joint hole, of the first division plate, a coupling hole is formed in the first division plate, the second division plate, a first resonant rod, a second resonant rod or a third resonant rod, and one end of a coupling rod is used for being connected with the public joint while the other end thereof is inserted into the coupling hole. The double-cavity-layer combiner and the public port device thereof have the advantages that bandwidth distribution of a vertically double-layer three-channel port can be achieved only with one rod insertion type coupler, so that a double-layer structure is widely applicable to a modern mobile communication system; without a public resonant cavity required in a traditional structure design, the combiner is small in insertion loss and size, convenient to process and low in processing cost.

Description

technical field [0001] The invention relates to the technical field of communication equipment, in particular to a double-cavity combiner and a common port device thereof. Background technique [0002] In modern mobile communication technology, microwave devices composed of microwave filters have become an indispensable and important part. Among them, the microwave cavity combiner is composed of multi-channel filters. When there are many passbands, the use of double-layer cavity arrangement is conducive to the miniaturization of the device. At present, the commonly used double-layer cavity combiner is only used to realize the combination of the two filter channels of the upper and lower layers, and when it is necessary to realize the combination of three filter channels, it is necessary for the three filter channels to use tapped metal wires to directly connect with the common There will be three solder joints on the common port and the coupling bar, which will make the int...

AI Technical Summary

Problems solved by technology

At present, the commonly used double-layer cavity combiner is only used to realize the combination of the two filter channels of the upper and lower layers, and when it is necessary to realize the combination of three filter channels, it is necessary for the three filter channels to use tapped metal wires to directly connect with the common There will be three solder joints on the common port and the coupling bar, which will make the intermodulation index of the combiner much worse; or it is necessary to add an additional public resonant cavity to the first layer to combine the two channels. In order to realize the combination of upper and lower layers and three channels, this design will increase the number of resonant cavities, which not only increases the insertion loss and production cost, but also cannot further miniaturize the device

Images