Semiconductor processing apparatus

Abstract

The present invention provides a semiconductor processing apparatus. The semiconductor processing apparatus comprises a reaction chamber, a process gas path and a blowing device; a carrying device used for fixing a wafer is arranged in the reaction chamber; the process gas path is used for conveying a process gas to the reaction chamber; the blowing device includes a gas intake pipeline and a gas source, wherein the gas source is used for blowing a gas to the gas intake pipeline; the gas intake pipeline is arranged in the chamber wall of the reaction chamber; the gas intake end of the gas intake pipeline is connected with the gas source; and the gas outgoing end of the gas intake pipeline is arranged on the chamber side wall of the reaction chamber and is used for conveying the blowing gas towards the upper surface of the wafer along a direction parallel to the upper surface of the wafer. With the semiconductor processing apparatus of the present invention adopted, particles falling on the upper surface of the wafer before and after a process can be removed, and therefore, partial etching defects can be avoided, and the yield of products can be improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor processing equipment. Background technique [0002] Shallow trench isolation etching is one of the most important processes in integrated circuit manufacturing, which directly affects the electrical performance and stability of devices. For the shallow trench isolation etching process, the control of etching defects is the most critical factor to improve product yield. In actual production, the main reason for the occurrence of etching defects is that there will be large-sized Particles fall on the surface of the wafer, causing the etching pattern to be destroyed, which directly affects the product yield. [0003] figure 1 It is a sectional view of conventional semiconductor processing equipment. see figure 1 , the semiconductor processing equipment includes a reaction chamber 1 , an electrostatic chuck 2 is arranged in the reaction...

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Problems solved by technology

[0004] In practical applications, large particles often fall off before and after the etching process. These particles adhere to the wafer surface and cause etching defects, which seriously affects the product yield.

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