Semiconductor processing apparatus

A processing equipment and semiconductor technology, applied in semiconductor/solid-state device manufacturing, discharge tubes, electrical components, etc., can solve problems such as etching defects, particle drop, and affecting product yield, so as to avoid etching defects and improve product quality. The effect of yield

Inactive Publication Date: 2017-06-09
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

[0004] In practical applications, large particles often fall off before and after the etching process. These

Method used

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  • Semiconductor processing apparatus
  • Semiconductor processing apparatus
  • Semiconductor processing apparatus

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Embodiment Construction

[0021] In order for those skilled in the art to better understand the technical solutions of the present invention, the semiconductor processing equipment provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0022] figure 2 A cross-sectional view of the semiconductor processing equipment provided by the embodiment of the present invention. see figure 2 , the semiconductor processing equipment includes a reaction chamber 100 , a process gas path and a purging device, wherein a carrying device 11 for fixing a wafer 12 is provided inside the reaction chamber 100 , and is electrically connected to a bias power supply 22 . The carrying device 11 can be an electrostatic chuck or a mechanical chuck or the like. Moreover, a coil 23 is provided above the top dielectric window 101 of the reaction chamber 100 , and is electrically connected to an excitation power source 25 . Moreover, a central nozzle 24 is provided on ...

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Abstract

The present invention provides a semiconductor processing apparatus. The semiconductor processing apparatus comprises a reaction chamber, a process gas path and a blowing device; a carrying device used for fixing a wafer is arranged in the reaction chamber; the process gas path is used for conveying a process gas to the reaction chamber; the blowing device includes a gas intake pipeline and a gas source, wherein the gas source is used for blowing a gas to the gas intake pipeline; the gas intake pipeline is arranged in the chamber wall of the reaction chamber; the gas intake end of the gas intake pipeline is connected with the gas source; and the gas outgoing end of the gas intake pipeline is arranged on the chamber side wall of the reaction chamber and is used for conveying the blowing gas towards the upper surface of the wafer along a direction parallel to the upper surface of the wafer. With the semiconductor processing apparatus of the present invention adopted, particles falling on the upper surface of the wafer before and after a process can be removed, and therefore, partial etching defects can be avoided, and the yield of products can be improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor processing equipment. Background technique [0002] Shallow trench isolation etching is one of the most important processes in integrated circuit manufacturing, which directly affects the electrical performance and stability of devices. For the shallow trench isolation etching process, the control of etching defects is the most critical factor to improve product yield. In actual production, the main reason for the occurrence of etching defects is that there will be large-sized Particles fall on the surface of the wafer, causing the etching pattern to be destroyed, which directly affects the product yield. [0003] figure 1 It is a sectional view of conventional semiconductor processing equipment. see figure 1 , the semiconductor processing equipment includes a reaction chamber 1 , an electrostatic chuck 2 is arranged in the reaction...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01J37/32
CPCH01L21/67011H01J37/32H01J37/32431H01J37/32449H01J37/32871
Inventor 李广
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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