Epitaxial wafer of gallium nitride-based light-emitting diode and manufacturing method thereof
A light-emitting diode, gallium nitride-based technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the luminous efficiency of light-emitting diodes, reducing the effective recombination of electrons and holes, and low mobility and mobility. Good growth quality, improve effective compounding, and ensure the effect of energy level matching
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Embodiment 1
[0022] An embodiment of the present invention provides an epitaxial wafer of a gallium nitride-based light-emitting diode, see figure 1 , the epitaxial wafer includes a sapphire substrate 1, and a GaN buffer layer 2, an undoped GaN layer 3, an N-type GaN layer 4, a multi-quantum well layer 5, a P-type AlGaN layer 6, P-type GaN layer 7 .
[0023] In this embodiment, the multi-quantum well layer is formed by alternately stacking multi-layer quantum well layers and multi-layer quantum barrier layers, the quantum well layers are InGaN layers doped with Al, and the quantum barrier layers are GaN layers. The multilayer quantum well layer belongs to the front well, the middle well, and the back well in turn along the stacking direction of the multilayer quantum well layer. The thickness of the quantum well layer belonging to the front well is greater than the thickness of the quantum well layer belonging to the middle well, and the quantum well layer belonging to the middle well The...
Embodiment 2
[0038] An embodiment of the present invention provides a method for manufacturing an epitaxial wafer of a GaN-based light-emitting diode, which is suitable for manufacturing the epitaxial wafer provided in Embodiment 1, see figure 2 , the production method includes:
[0039] Step 200: Control the temperature to 1000-1200° C., anneal the sapphire substrate in a hydrogen atmosphere for 8 minutes, and perform nitriding treatment.
[0040] Understandably, step 200 can clean the surface of the sapphire substrate.
[0041] In this embodiment, the sapphire substrate 1 adopts (0001) crystal orientation sapphire.
[0042] Step 201: Control the temperature to 400-600° C. and the pressure to 400-600 Torr to grow a GaN buffer layer on the sapphire substrate.
[0043] Optionally, the thickness of the GaN buffer layer may be 15-35 nm.
[0044] Optionally, after step 201, the preparation method may further include:
[0045] The control temperature is 1000-1200° C., the pressure is 400-6...
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