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Epitaxial wafer of gallium nitride-based light-emitting diode and manufacturing method thereof

A light-emitting diode, gallium nitride-based technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the luminous efficiency of light-emitting diodes, reducing the effective recombination of electrons and holes, and low mobility and mobility. Good growth quality, improve effective compounding, and ensure the effect of energy level matching

Active Publication Date: 2019-05-14
HC SEMITEK ZHEJIANG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The quality of the hole is larger than that of the electron, and the mobility and mobility are lower than that of the electron. In addition, only a small part of the Mg doped in the P-type GaN layer can be activated, so the number of holes injected into the multi-quantum well layer is small, and the electrons are in the MQW layer. The number of multi-quantum well layers is too large, which is prone to overflow, reduces the effective recombination of electrons and holes, and reduces the luminous efficiency of light-emitting diodes

Method used

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  • Epitaxial wafer of gallium nitride-based light-emitting diode and manufacturing method thereof
  • Epitaxial wafer of gallium nitride-based light-emitting diode and manufacturing method thereof

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Embodiment 1

[0022] An embodiment of the present invention provides an epitaxial wafer of a gallium nitride-based light-emitting diode, see figure 1 , the epitaxial wafer includes a sapphire substrate 1, and a GaN buffer layer 2, an undoped GaN layer 3, an N-type GaN layer 4, a multi-quantum well layer 5, a P-type AlGaN layer 6, P-type GaN layer 7 .

[0023] In this embodiment, the multi-quantum well layer is formed by alternately stacking multi-layer quantum well layers and multi-layer quantum barrier layers, the quantum well layers are InGaN layers doped with Al, and the quantum barrier layers are GaN layers. The multilayer quantum well layer belongs to the front well, the middle well, and the back well in turn along the stacking direction of the multilayer quantum well layer. The thickness of the quantum well layer belonging to the front well is greater than the thickness of the quantum well layer belonging to the middle well, and the quantum well layer belonging to the middle well The...

Embodiment 2

[0038] An embodiment of the present invention provides a method for manufacturing an epitaxial wafer of a GaN-based light-emitting diode, which is suitable for manufacturing the epitaxial wafer provided in Embodiment 1, see figure 2 , the production method includes:

[0039] Step 200: Control the temperature to 1000-1200° C., anneal the sapphire substrate in a hydrogen atmosphere for 8 minutes, and perform nitriding treatment.

[0040] Understandably, step 200 can clean the surface of the sapphire substrate.

[0041] In this embodiment, the sapphire substrate 1 adopts (0001) crystal orientation sapphire.

[0042] Step 201: Control the temperature to 400-600° C. and the pressure to 400-600 Torr to grow a GaN buffer layer on the sapphire substrate.

[0043] Optionally, the thickness of the GaN buffer layer may be 15-35 nm.

[0044] Optionally, after step 201, the preparation method may further include:

[0045] The control temperature is 1000-1200° C., the pressure is 400-6...

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Abstract

The present invention discloses an epitaxial wafer of a GaN-based light emitting diode and a manufacturing method thereof, and belongs to the semiconductor technology field. The epitaxial wafer comprises a sapphire substrate, a GnN buffer layer, an undoped GaN layer, an N-type GaN layer, a multiple quantum well layer, a P-type AlGaN layer and a P-type GaN layer. The multiple quantum well layer is formed by laminating a plurality of quantum well layers and a plurality of quantum barrier layers alternatively, the quantum well layers are InGaN layers doped with Al, and the quantum barrier layers are GaN layers. The plurality of quantum well layers belong to the front well, the intermediate well and the rear well orderly along the lamination direction of the plurality of quantum well layers, the thicknesses of the quantum well layers belonging to the front well, the quantum well layers belonging to the intermediate well and the quantum well layers belonging to the rear well are reduced orderly, the contents of the In components are increased orderly, and the Al doping concentrations are increased orderly. According to the present invention, the electrons as much as possible are limited in the several quantum well layers closest to the P-type AlGaN layer, at the same time, the multiple quantum well layer is injected in a hole conveniently, and the luminous efficiency of the light-emitting diode is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an epitaxial wafer of a gallium nitride-based light-emitting diode and a manufacturing method thereof. Background technique [0002] Light Emitting Diode (English: Light Emitting Diode, LED for short) is a semiconductor device capable of effectively converting electrical energy into light energy. At present, gallium nitride-based LEDs have received more and more attention and research. [0003] The epitaxial wafer of a GaN-based LED includes a sapphire substrate, a GaN buffer layer, an undoped GaN layer, an N-type GaN layer, and a multiple quantum well layer (English: Multiple Quantum Well, referred to as: MQW) stacked on the sapphire substrate in sequence. , P-type AlGaN layer, and P-type GaN layer. When a current flows, the electrons in the N-type GaN layer and the holes in the P-type GaN layer enter the multi-quantum well layer to recombine and emit light. [0004] In...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/06H01L33/32H01L33/00
CPCH01L33/007H01L33/06H01L33/325
Inventor 王群郭炳磊董彬忠李鹏王江波
Owner HC SEMITEK ZHEJIANG CO LTD