A kind of microchannel formation method

A micro-channel and channel technology, applied in chemical instruments and methods, laboratory utensils, laboratory containers, etc., can solve the problems that affect the surface characteristics of chip channels and the depth of channels cannot be guaranteed.

Active Publication Date: 2019-07-30
同昕生物技术(北京)有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing sealing methods, such as laser welding, ultrasonic welding, solvent-assisted sealing, etc., will affect the surface characteristics of the chip channel to varying degrees
With the sealing method pasted with pressure-sensitive adhesive, the channel depth cannot be guaranteed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of microchannel formation method
  • A kind of microchannel formation method
  • A kind of microchannel formation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0096] Such as figure 1 , shown in 2 and 3, a method for forming a microchannel with a certain thickness, comprising a cover sheet 1, a substrate 2 and a channel thickness control device 3 from top to bottom, an interlayer is arranged between the cover sheet 1 and the substrate 2 4. The channel control device 3 controls the interlayer thickness. The channel thickness control device 3 includes a rectangular groove 7, and a support member 8 is arranged in the groove, and the height of the support member 8 is greater than the thickness of the substrate 2; the area of ​​the substrate 2 is slightly smaller than that of the channel thickness control device. The area of ​​the groove 7 is installed, and the substrate 1 of a certain thickness is directly placed in the groove 7, and the support member 8 on the frame of the groove 7 clamps the substrate 1; the microchannel 5 is drawn on the substrate with uv glue until the microchannel 5. When the thickness reaches the length of the pa...

Embodiment 2

[0098] Such as figure 1 , 2, shown in 4, a kind of microchannel formation method with certain thickness, comprises top-down cover sheet 1, substrate 2 and channel thickness control device 3, there is cavity interlayer between described cover sheet 1, substrate 2 4. The channel control device 3 controls the thickness of the interlayer 4, and the cover sheet 1, the substrate 2, and the channel thickness control device 3 have the same area. Described channel thickness control device 3 comprises a rectangular groove 7, is provided with support member 8 in described groove 7, and the height of described support member 8 is greater than the thickness of substrate 2; The corresponding support member 8 of described substrate 2 is corresponding There is a positioning hole 6 at the position, put the substrate 1 of a certain thickness into the groove 7 of the channel thickness control device, and the positioning hole 6 directly passes through the groove support 8, so that the channel t...

Embodiment 3

[0100] figure 1 , 2 , 5, the present invention has a certain thickness microchannel forming method, including top-down cover sheet 1, channel thickness control device 3, substrate 2, channel thickness control device 3 is a support member arranged on the substrate upper surface 8. The cover sheet 1 and the substrate 2 rely on the support 8 to form an interlayer 4; use uv glue to draw the microchannel 5 on the substrate until the thickness of the microchannel 5 reaches the height of the support 8, then cover the cover sheet 1, cover The thickness of the interlayer 4 between the sheet and the substrate is equal to the thickness of the microchannel 5, and the cover sheet and the substrate can be rapidly sealed into a test card by curing.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for forming a micro-channel with a certain thickness. The method is characterized by comprising the following steps: preparing a cover piece and a base piece, wherein an interlayer is arranged between the cover piece and the base piece; drawing the micro-channel on the base plate with an adhesive, wherein the thickness of the micro-channel is equal to that of the interlayer; placing the cover piece, and curing to achieve rapid sealing connection of the cover piece and the base piece. The method is simple, feasible and convenient to operate, and the technical defect that the thickness of a channel cannot be ensured when a sealing and connection mode of adhesion with a pressure-sensitive adhesive is adopted can be effectively avoided.

Description

technical field [0001] The invention relates to the field of microfluidic chips, in particular to a method for forming a microchannel. Background technique [0002] With the advancement of technology and the continuous improvement of application requirements, biochemical analysis equipment has been developing in the direction of miniaturization, integration, automation and parallel processing in recent years. It is hoped to reduce the economic cost by reducing the amount of expensive reagents, and to speed up the analytical process by reducing the characteristic size of the analytical instrument. For example, large-scale and parallel biological probe arrays save a lot of reagent costs and speed up the analysis process, which promotes the early completion of the Human Genome Project. The manufacture, use and maintenance of large-scale equipment are complicated, while small-scale equipment only needs to process micro-sample. Through the integrated microfluidic network, the co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B01L3/00
CPCB01L3/502707B01L2300/0887B01L2300/0896B82Y40/00
Inventor 肖智焦守恕李全吴凡
Owner 同昕生物技术(北京)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap