Insulating paper support wood piece adhesion equipment

Abstract

The invention relates to an insulating paper supporting wood chip bonding equipment, which comprises an insulating paper winding roller, a supporting wood chip placing roller, and an insulating paper recovery roller; the upper part of the supporting wood chip placing roller is provided with a supporting wood chip placing mechanism; The limit ring is concentrically fixed, and the outer edge of the limit ring is vertically provided with an annular retaining ring, and a number of support wood chip placement sleeves are arranged in an annular array on the top outer wall of the support wood chip placement roller; the support wood chip placement mechanism includes a flat support The wood chip placement groove is provided with a support wood chip discharge hole at one end of the support wood chip placement groove, and the support wood chip discharge hole is located at the upper position of the support wood chip placement sleeve. The upper part is synchronously fixed with an exciting motor; the bottom of the insulating paper recovery roller is provided with a circular truncated guide block, and the upper bottom of the guide block is fixedly connected with the bottom of the insulating paper recovery roller.

Description

technical field [0001] The invention relates to insulating paper supporting wood chip bonding equipment, which belongs to the field of insulating paper production equipment. Background technique [0002] For some insulation papers with required thickness, a relatively low-cost method is to paste support wood chips on the surface of the insulation paper to increase its thickness. Traditional support wood chip sticking equipment is generally manual or semi-manual, through the relevant positioning frame , to realize the fixed spacing setting between the supporting wood pieces, and then glue them to the insulating paper. The positioning wood pieces on the positioning frame are generally placed manually, which is labor-intensive, and it is easy to cause local supporting wood pieces to be missing. Contents of the invention [0003] The technical problem to be solved by the present invention is: to overcome the technical problem in the prior art that the supporting wood chips can...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: to overcome the technical problem in the prior art that the supporting wood chips cannot be automatically placed on the positioning frame, and to provide a bonding equipment for insulating paper supporting wood chips

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