Manufacturing method for improving PCBA production efficiency

Abstract

The invention discloses a manufacturing method for improving PCBA production efficiency, and belongs to the technical field of computer processing and manufacturing. The manufacturing method for improving PCBA production efficiency of the present invention includes the following steps: S1: making a printed steel plate with special openings to ensure that the solder paste at the position of the DIP material meets the welding requirements; S2: the components used in the production meet high temperature resistance and are suitable for SMT placement machines SMD packaging requirements for medium and high-speed machines and general-purpose machines; S3: DIP components are installed on the corresponding SMT machines through loading trolleys and feeders; S4: Automatic insertion machines are used for components that cannot meet the requirements of the SMT machines Or manually insert into the corresponding part position; S5: After reflow soldering, check the welding effect of the part. The manufacturing method for improving the PCBA production efficiency of the invention can greatly reduce the PCBA production cost, improve the product production quality, shorten the production cycle, and has good popularization and application value.

Description

technical field [0001] The invention relates to the technical field of computer processing and manufacturing, and specifically provides a manufacturing method for improving PCBA production efficiency. Background technique [0002] Because the computer has the advantages of storing a large amount of information and obtaining information conveniently and quickly, it has been widely used. Especially with the further development of society and economy, the application fields of computers have been further expanded, and users have higher and higher requirements for the performance of computers. Therefore, the configurations of computers have also been greatly improved to adapt to different uses. requirements for its performance. The improvement of computer performance comes from the improvement of configuration, that is, the improvement of components in the computer. With the development of electronic products, the replacement of electronic products is getting faster and faster...

AI Technical Summary

Problems solved by technology

The PCBA process also includes the wave soldering process. The wave soldering process requires manual work to insert DIP materials. The process control is difficult. After flux spray and wave soldering, manual maintenance is required. The manpower requirement is high, and the cost is high compared with reflow soldering; Moreover, flux spray pollutes the environment and damages the health of operators; the adjustment of wave soldering furnace parameters requires high technical personnel;

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