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Method for manufacturing outer-layer circuit of rigid-flex board

A technology of soft-rigid combination board and outer layer circuit, which is applied in printed circuit manufacturing, improvement of metal adhesion of insulating substrate, printed circuit, etc., can solve problems such as poor quality, achieve mass production, and solve dry film pressure inaccuracy , to avoid the effect of open circuit

Inactive Publication Date: 2017-06-13
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a method for manufacturing the outer circuit of the rigid-flex board, which aims to solve the problem that the existing manufacturing process of the outer circuit of the rigid-flex board is prone to poor quality

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  • Method for manufacturing outer-layer circuit of rigid-flex board

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Embodiment Construction

[0022] The present invention provides a method for manufacturing the outer circuit of a rigid-flex board. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of the method for manufacturing the outer layer circuit of a rigid-flex board of the present invention, as shown in the figure, which includes steps:

[0024] S1. Wetting the soft and hard board;

[0025] S2. Apply film to the soft and hard board, and the film pressure is 3.5~5.5kg / cm 2 ;

[0026] S3, performing air pressure treatment on the soft and hard combination board;

[0027] S4. Perform exposure, development, etching, and film-removing treatment on the rigid-flex bo...

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Abstract

The invention discloses a method for manufacturing an outer circuit of a rigid-flex board, comprising the steps of: A. performing wetting treatment on the rigid-flex board; cm 2 ; C. Perform air pressure treatment on the rigid-flex board; D. Expose, develop, etch, and remove the film on the rigid-flex board in sequence. Through the combination of the wetting treatment and the air pressure treatment of the present invention, the problem of inaccurate dry film pressing on the steps of the soft and hard composite boards bonded by ordinary film laminating machines is solved, the open circuit of the steps is avoided, and the mass production of products with steps is realized. .

Description

technical field [0001] The invention relates to the field of manufacturing a rigid-flex board, in particular to a method for manufacturing an outer circuit of a rigid-flex board. Background technique [0002] During the production process of the soft-rigid board, the soft board part needs to be uncovered to remove the hard board part. At present, the uncovering process in the industry often uses two depth-controlling treatments, one for pre-pressing before lamination, one after lamination, and one more depth-controlling for molding. Before lamination, there will be a certain height difference at the junction of soft and hard. When making the outer circuit, it is easy to stick the film with an ordinary film laminating machine. The film will not be tight. Open circuit problem after etching. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention [0004] In view of the deficiencies in the prior art above, the purpose of the pr...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38
CPCH05K3/381H05K3/361
Inventor 付凤奇任城洵田晓燕
Owner SHENZHEN KINWONG ELECTRONICS
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