Check patentability & draft patents in minutes with Patsnap Eureka AI!

Potting method for medium high-overload recording device

A recording device, high overload technology, applied in the direction of sealed enclosures, electrical components, electrical equipment enclosures/cabinets/drawers, etc., can solve damage to electronic components, solder joints, reduce the reliability of recording devices, and cannot record and analyze data, etc. problems, to achieve the effects of reducing stress and damage, reducing foaming reaction time, and improving product reliability and yield

Inactive Publication Date: 2017-06-13
XIAN KEYWAY TECH
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For the filling and sealing of the recording device, it is common practice to put the recording device that has been debugged and tested into a closed structure and pour it into a two-component polyurethane foam material. However, due to the characteristics of the two-component polyurethane foam material, During the curing process, due to the impact of the potting amount and potting process, it will generate horizontal or vertical stress on the printed circuit board and electronic components, and damage the electronic components and solder joints on the printed circuit board, thereby reducing Recording device reliability
Even if the products pass the inspection, there are quality risks, and there may be abnormal electrical functions when used in a high overload environment, and data cannot be recorded and analyzed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Potting method for medium high-overload recording device
  • Potting method for medium high-overload recording device
  • Potting method for medium high-overload recording device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0021] The method for potting a medium-sized high-overload recording device according to the present invention, the medium-sized high-overload recording device includes a printed circuit board assembly, a battery unit, and a casing; it is characterized in that it includes the following steps: (1) according to the printed circuit board assembly structure, design and manufacture the control circuit unit case for placing the printed circuit board assembly; (2) design and manufacture the battery unit case for placing the battery according to the battery structure; (3) use two-component polyurethane foam material The printed circuit board assembly is potted and sealed in the control circuit unit casing; (4) the battery is potted and sealed in the battery unit casing with two-component polyurethane foam material; (5) the battery is potted and sealed with two-component polyurethane foam material The control circuit unit housing and the battery unit housing are encapsulated in the afor...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a potting method for a medium high-overload recording device, and relates to a process design method for the medium high-overload recording device. The medium high-overload recording device comprises a printed-circuit board component, a battery unit and a shell; the method is characterized by comprising the following steps that 1, a control circuit unit shell is designed according to the structure of the printed-circuit board component; 2, a battery unit shell is designed according to a battery structure; 3, a polyurethane foaming material is adopted for potting the printed-circuit board component into the control circuit unit shell; 4, the polyurethane foaming material is adopted for potting the battery into the battery unit shell; 5, the polyurethane foaming material is adopted for potting the control circuit unit shell and the battery unit shell into the shell. By improving the traditional method, the foaming reaction time is shortened, the foaming reaction temperature is lowered, the stress action and damage which are generated by an electronic component on the printed-circuit board are lowered, the reliability of the medium high-overload recording device is improved, and the yield of the medium high-overload recording device is increased, and the recording device has the capacity of bearing the high-overload property.

Description

technical field [0001] The invention relates to a process design method for a medium-sized high overload recording device, in particular to a method for potting a medium-sized high overload recording device. Background technique [0002] Since the beginning of the 21st century, the international situation has become more and more severe, and missile control technology is widely used in aviation, aerospace and other fields. In order to realize real-time tracking, recording and analysis of the test track and test data of high overload products, the high overload recording device has become a recorder. Ideal equipment for high-overload products. With the application of embedded computers in high-overload products, the requirements for recording and analysis in high-overload recording devices are increasing, and the volume of recording devices is also increasing accordingly. Therefore, medium-sized high-overload recording devices are Came into being. [0003] The characteristic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/06C08L75/04
CPCH05K5/064C08L75/04C08L2203/14
Inventor 刘升孟庆飚张凤仪
Owner XIAN KEYWAY TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More