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Microstructure forming apparatus

A processing device and microstructure technology, applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve the problems of time-consuming processing, large influence of process parameters, and unfavorable elastic production, etc., and achieve the effect of improving versatility

Inactive Publication Date: 2017-06-20
METAL INDS RES & DEV CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The semiconductor manufacturing process corresponding to the process below 500 nanometers is mainly processed by the dry etching process. Although the dry etching process can obtain more accurate shape accuracy, the processing is time-consuming and the process parameters are greatly affected by the material.
In addition, the semiconductor process cannot design and produce target features corresponding to different sizes in real time, which is not conducive to flexible production

Method used

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  • Microstructure forming apparatus
  • Microstructure forming apparatus
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Embodiment Construction

[0017] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0018] see picture figure 1 and figure 2 , a first embodiment of the microstructure processing device 1 of the present invention is suitable for processing a workpiece 2 to be processed. 3. A first conical mirror 4 located between the workpiece 2 and the light source 3, a second conical mirror 5 located between the first conical mirror 4 and the workpiece 2, and a conical mirror located between the workpiece 2 and the light source 3. The lens 6 between the second conical mirror 5 and the workpiece 2 to be processed. The first cone mirror 4 includes a first annular cone surface 41 , and a first plane 42 opposite to the first annular cone surface 41 and facing the light source 3 . The second cone mirror 5 includes a second cone surface 51 facing the first cone surface 41 , and a second plane 52 opposite to the cone surface 51 and facing the lens 6 ....

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Abstract

A microstructure forming apparatus is adapted for processing a workpiece and includes: a light source for emitting light toward the workpiece; a first axicon disposed between the light source and the workpiece; and a second axicon disposed between the first axicon and the workpiece. Light emitted from the light source forms a high-order Bessel beam after passing through the first axicon and the second axicon in sequence for processing and forming a microstructure in the workpiece.

Description

technical field [0001] The invention relates to a microstructure processing device, in particular to a microstructure processing device using a Besso beam for processing. Background technique [0002] Although ultra-precision machining technology at this stage can meet the processing needs and precision requirements above 800 nanometers, the current processing methods below 800 nanometers are still dominated by semiconductor manufacturing processes. The semiconductor manufacturing process corresponding to the process below 500 nanometers is mainly processed by the dry etching process. Although the dry etching process can obtain more accurate shape accuracy, the processing is time-consuming and the process parameters are greatly affected by the material. In addition, the semiconductor manufacturing process cannot design and produce target features corresponding to different sizes in real time, which is not conducive to flexible production. Contents of the invention [0003...

Claims

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Application Information

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IPC IPC(8): G02B27/09
CPCG02B27/0911G02B27/095B23K26/0006B23K26/0648B23K26/0652B23K26/352B23K2101/40B23K2103/56H01L21/268
Inventor 詹家铭洪正翰林英傑
Owner METAL INDS RES & DEV CENT