High-heat-dissipation diode packaging structure

Abstract

The invention discloses a high-heat-dissipation diode packaging structure. The high-heat-dissipation diode packaging structure comprises a substrate, a heat dissipation element, a diode chip, a negative electrode pin and a packaging adhesive body; the diode chip and the heat dissipation element are fixedly connected with two opposite surfaces of the substrate respectively; a positive electrode pin and the negative electrode pin are electrically connected with the diode chip; the substrate, the heat dissipation element and the diode chip are all packaged in the packaging adhesive body; the high-heat-dissipation diode packaging structure also comprises a reflective cylinder and a plurality of heat conducting strips; the reflective cylinder is arranged on the packaging adhesive body in an external sleeving manner; the multiple heat conducting strips are arranged around the diode chip; each heat conducting strip is embedded in the packaging adhesive body; the end part of each heat conducting strip is fixedly connected with the substrate; and the outer wall of each heat conducting strip is a reflective layer. According to the high-heat-dissipation diode packaging structure provided by the invention, the heat conducting strips in the packaging adhesive body transfer heat to the substrate; then the heat is dissipated from the substrate through the heat dissipation element; and meanwhile, the heat conducting strips emit the light from the diode chip through the reflective layers on the outer walls of the heat conducting strips, so that a condition that the light emitting effect of the diode chip is affected by the heat conducting strips can be prevented.

Description

technical field [0001] The invention relates to semiconductor technology, in particular to a high heat dissipation diode packaging structure. Background technique [0002] A diode package is a basic semiconductor element. As is known, a diode package includes a substrate, a diode chip disposed on the substrate, an anode pin and a cathode pin connected to the diode chip, the substrate, the diode chip, and at least part of the anode lead. Both the pin and the negative pin are encapsulated in the encapsulation compound. [0003] The heat dissipation performance is an important indicator that affects the service life and luminous efficacy of the diode package. The diode chip will generate more heat during operation. In order to dissipate the heat, most of the prior art substrates are equipped with heat sinks on the side away from the diode chip, such as Aluminum products with high thermal conductivity, aluminum alloy products, etc., in order to further improve the heat dissipat...

AI Technical Summary

Problems solved by technology

[0004] The reason why the existing technology concentrates on the heat dissipation structure on the back of the substrate (the side away from the diode chip) is that the front side of the substrate (the side where the diode chip is installed) is an encapsulant, and the encapsulation is a transparent structure, which is the light-emitting channel of the diode chip. , the heat dissipation structure cannot be set inside

However, in practical applications, most of the heat sinks on the back of the substrate have high-efficiency heat dissipation capabilities, and their heat dissipation capabilities are sufficient. It is precisely the encapsulant located on the front of the substrate, which has a low thermal conductivity and no additional heat dissipation structure, making it a concentrated heat source. It is difficult to fully release, which will affect the service life and luminous efficacy of the diode package

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