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Thin film transistor, array substrate, method for manufacturing array substrate, and display panel

Active Publication Date: 2017-06-23
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the bonding performance between the protective layer and the photoresist is not good, and peeling will occur during the etching process, which will lead to inaccurate shapes of the conductive pattern layer for etching stars, resulting in defective

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  • Thin film transistor, array substrate, method for manufacturing array substrate, and display panel
  • Thin film transistor, array substrate, method for manufacturing array substrate, and display panel
  • Thin film transistor, array substrate, method for manufacturing array substrate, and display panel

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Embodiment Construction

[0049] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0050] In the present invention, the orientation words "up and down" used refer to the directions of "up and down" in the drawings.

[0051] As one aspect of the present invention, a thin film transistor is provided, the thin film transistor includes a gate electrode, a source electrode and a drain electrode, wherein at least one of the gate electrode, source electrode and drain electrode includes For the stacked auxiliary electrode layer, first guard electrode layer and main electrode layer, the activity of the material for the auxiliary electrode layer is greater than that of the material for the first guard electrode layer.

[0052] When manufacturing the th...

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Abstract

The invention provides a thin film transistor comprising a gate, a source, and a drain, wherein at least one of the gate, the source, and the drain includes an auxiliary electrode layer, a first protective electrode layer and a main electrode layer which are stacked successively from top to bottom. The material of the auxiliary electrode layer is more active than the material of the first protective electrode layer. The invention also provides an array substrate, a method for manufacturing the array substrate, and a display panel including the array substrate. In the thin film transistor, photoresist coats an auxiliary conductive material layer. Since the metal forming the auxiliary conductive material layer has high activity, electrons in the outer layer of the atoms of the material are very likely to be lost so that the auxiliary conductive material layer can firmly adsorb a photoresist layer. Further, in an etching process, a shielding pattern is not liable to be peeled off so that a more accurate conductive pattern can be obtained and the yield of the thin film transistor can be improved.

Description

technical field [0001] The present invention relates to the field of display devices, in particular to a thin film transistor, an array substrate including the thin film transistor, a method for manufacturing the array substrate, and a display panel including the array substrate. Background technique [0002] The array substrate of the display panel includes a plurality of conductive pattern layers located in different layers, for example, a gate line pattern layer, a source-drain pattern layer, and the like. In order to ensure that the conductive pattern has good conductivity, the conductive pattern layer is usually made of a material with low resistivity. Since conductive materials with higher resistivity usually have higher activity, in order to prevent the conductive material from being oxidized, a protective layer is also deposited on the conductive material with lower resistivity. [0003] Specifically, the steps of making the conductive pattern layer include: deposit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/786H01L27/12H01L21/77
CPCH01L27/1214H01L27/1259H01L29/786
Inventor 崔承镇
Owner BOE TECH GRP CO LTD