Bionic stress sensing structure and formation method thereof
A bionic and conductive ink technology, applied in the field of strain sensing, can solve the problems of low cost, complicated preparation process, poor stability of synthesis process, etc.
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2017-07-18
Smart Images

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Abstract
Description
Technical field
[0001] The invention relates to the field of strain sensing, in particular to a bionic strain sensing structure and a forming method thereof. Specifically, it relates to a method for preparing a biomimetic strain sensing structure by printing on a paper substrate. Brush the conductive coating on the surface of the paper substrate, and form a strip-shaped parallel crack zone after bending and breaking, forming a specific bionic crack structure. When the paper substrate is strained after being stressed, the crack width changes, that is, the contact degree of the crack wall changes, resulting in a change in its overall resistance, that is, a piezoresistive phenomenon is generated, and the strain sensing function is realized. The prepared strain sensing structure is a bionic structure inspired by scorpion vibration perception, and the bionic model is derived from the slit receptor of scorpion vibration perception. Background technique
[0002] Sensors for strain mea...
Examples
Embodiment Construction
[0031] Such as figure 1 As shown, according to the inspiration of the slice structure of the scorpion crack receptor, the following figure 2 The bionic strain sensing structure on the paper substrate 1 is shown. figure 1 In the middle, the arrow mark is the hard chitin shell on the surface of the scorpion, and the soft subcutaneous tissue below the scorpion. The hard chitin shell is divided by the 1-7 cracks marked in the figure, forming a parallel crack belt structure. The bionic strain sensing structure inspired by this is such as figure 2 As shown, the upper layer is a dense and hard conductive layer adhered to a softer paper substrate 1. At the same time, there are multiple parallel cracks on the conductive layer, forming a strain sensing structure similar to the scorpion crack receptor structure. Its structure is characterized by printing and processing a hard conductive layer containing multiple parallel cracks (crack bands) on a soft base material (paper base layer), wh...