Silver paste filled hole substrate processing method

Abstract

The invention discloses a method for processing a silver paste filling hole substrate, which is characterized in that: when making an outer layer circuit, firstly apply a wet film on both sides of the substrate and dry it, and then insert the dried substrate into a page-type Expose, develop and etch inside the fixture to form circuit patterns. The silver paste filling substrate processing method optimizes the production process, and replaces the traditional dry film with wet film, which is different from the circuit production method of traditional printed boards. The book page alignment method replaces the traditional manual eye alignment method, which greatly reduces The production cost of this type of double-sided printed board improves the production efficiency of this type of double-sided printed board and stabilizes the production quality of this type of double-sided printed board.

Description

technical field [0001] The invention relates to the technical field of PCB processing, in particular to a method for processing a substrate filled with silver paste. Background technique [0002] Silver paste filled substrate, also known as false double-sided board, is a printed board between a single-sided board and a double-sided board. It is composed of two-sided circuits, but does not require a special double-sided interconnection between layers. For printed boards, its interlayer interconnection method is not realized by sinking copper → electroplating copper. Its production cost greatly reduces the production cost and reduces the damage to the environment. Its interlayer interconnection method is generally realized through component pins or silver filling holes. It has the function of double-sided board, but its processing method is simpler than that of double-sided board. [0003] However, the production process of the traditional silver paste filling substrate is g...

AI Technical Summary

Problems solved by technology

According to this traditional production process, the photosensitive material used in the production process is a relatively expensive dry film as the carrier of the circuit forming. Since the hole must be drilled first and the film negative and the hole must be overlapped during the exposure alignment, so the stability can only be used. Not good, low efficiency, and manual visual alignment with high alignment skills for employees. Therefore, this production process has high production costs, poor stability, low efficiency, and high alignment skills for employees , it is difficult to form an effective core competitiveness in the market