A Laser Microhole Machining System

Abstract

The embodiment of the invention discloses a laser micro-hole processing system. Pulse lasers are divided into two beams of sub-pulse laser light sources with different energy by utilizing a light splitting module, the sub-pulse laser light source with larger energy can be incident on a to-be-processed micro-hole plane through a focusing module, and the second sub-pulse laser light source is incident on the to-be-processed micro-hole plane through a pulse adjusting module and the focusing module; and a pulse control module controls the two beams of sub-pulse laser light sources to perform alternate processing on a micro-holes according to a preset processing mode. The micro-hole is processed alternately through laser pulses with different energy and is subjected to pit formation, removal and shape dressing operation according to the pulses with different energy, the roundness of the inlet of the micro-hole is improved, the reduction of the re-cast layer and the reduction of the heat influence area are facilitated, the good micro-hole processing quality is obtained, and therefore the micro-hole forming quality is improved.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of laser processing, in particular to a laser microhole processing system. Background technique [0002] With the advancement of science and technology and the development of industrialization, micro-holes and micro-holes have been widely used in aerospace, defense industry, precision instruments and other fields. Modern industrial products have higher and higher requirements for the processing quality of micro-holes. Traditional Micro-hole machining technology can no longer meet the requirements. Among the many special processing technologies, laser processing is widely used in micro-hole processing due to its advantages of high efficiency, low cost, easy realization of multi-axis linkage control, and processing not limited by materials. [0003] Since laser processing belongs to thermal erosion processing, the processed micro-holes usually have some defects, and the quality of the mi...

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Problems solved by technology

[0003] Since laser processing belongs to thermal erosion processing, the processed micro-holes usually have some defects, and the quality of the micro-holes is not high, such as the roundness of the entrance and exit, the taper of the through hole, the recasting layer of the hole wall, etc., and the recasting layer There are microcracks, which will spread to the blade base material during the use of the parts, greatly reducing the service life of the product, and even causing serious accidents in some occasions

[0004] It can be seen that the traditional micro-hole machining method cannot meet the high-quality requirements of micro-hole machining due to the above-mentioned problems.

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