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Apparatus for grinding wafers

A technology of wafer and grinding head, applied in the field of semiconductor process equipment

Active Publication Date: 2021-07-16
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, the above non-uniformity may also be caused by the non-uniformity of the pressure applied at different locations on the wafer

Method used

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  • Apparatus for grinding wafers
  • Apparatus for grinding wafers
  • Apparatus for grinding wafers

Examples

Experimental program
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Embodiment Construction

[0050] The following disclosure provides many different embodiments or examples for implementing different features of the present invention. The following disclosure describes specific examples of components and their arrangements for simplicity of illustration. Of course, these specific examples are not intended to be limiting. For example, if the disclosure describes that a first feature is formed on or above a second feature, it means that it may include embodiments in which the above-mentioned first feature is in direct contact with the above-mentioned second feature, and may also include additional features. An embodiment in which the first feature and the second feature are formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the same reference symbols and / or symbols may be reused in different examples in the following disclosure. These repetitions are for simplicity and cla...

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Abstract

A device for performing chemical mechanical polishing on a wafer includes a polishing head with a fixed ring. The lapping head is configured to retain the wafer within the retaining ring. The fixed ring includes a first ring and a second ring. The first ring has a first hardness. The second ring is surrounded by the first ring, wherein the second ring has a second hardness which is smaller than the first hardness.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor processing device, and in particular to a device for grinding a wafer. Background technique [0002] Chemical Mechanical Polishing (CMP) is a common practice in forming integrated circuits. CMP is commonly used for planarization of semiconductor wafers. CMP utilizes a synergy of physical and chemical forces to grind a wafer. It can be implemented by applying a load force to the backside of a wafer and the wafer is placed on a polishing pad, wherein the polishing pad rests against the wafer, then the polishing pad and wafer are counter-rotated and contain abrasives and reactive A slurry of reactive chemicals passes between the two. CMP is an effective method to achieve overall planarization of a wafer. [0003] However, achieving a truly uniform grind is difficult due to various factors. For example, the slurry is dispensed from the top or bottom of the pad, which causes non-uniformity ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/00B24B37/10
CPCB24B37/00B24B37/32B24B37/20B24B37/042
Inventor 侯德谦蔡腾群林国楹佘铭轩蒋青宏李胜男卢永诚
Owner TAIWAN SEMICON MFG CO LTD