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Method and system for measuring gap and thickness

A technology for measuring gaps and gaps, applied in the field of measuring gaps and thicknesses, which can solve problems such as the potential for improvement

Active Publication Date: 2020-12-08
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Thus, while conventional techniques for measuring and controlling the gap between manufacturing tools and workpieces are generally adequate, there is still potential for future improvements

Method used

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  • Method and system for measuring gap and thickness
  • Method and system for measuring gap and thickness
  • Method and system for measuring gap and thickness

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Embodiment Construction

[0020] The present invention relates generally to IC device fabrication, and more particularly to improved techniques for controlling the clearance between a portion of a fabrication tool and a workpiece.

[0021] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. For example, in the following description, forming a first component over or on a second component may include embodiments in which the first component and the second component are formed in direct contact, and may also include embodiments in which the first component and the second component may be formed in direct contact. An embodiment in which an additional part is formed so that the first part and the second part may not be in direct contac...

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PUM

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Abstract

Embodiments of the present invention provide a system and method for determining a clearance between a manufacturing tool and a workpiece. In an exemplary embodiment, the method includes receiving a substrate in a tool defining a gap therebetween. A transducer disposed on the bottom surface of the substrate opposite the gap provides an acoustic signal that is conducted through the substrate. The transducer also receives a first echo from the top surface of the substrate defining the gap and a second echo from the bottom surface of the tool further defining the gap. The width of the gap is measured based on the first echo and the second echo. In some embodiments, the bottom surface of the tool is the bottom surface of the nozzle, and the nozzle provides liquid or gas in the gap when the transducer receives the first echo and the second echo. Embodiments of the invention also provide methods of measuring thickness.

Description

technical field [0001] Embodiments of the present invention relate to the field of semiconductors, and more particularly to methods and systems for measuring gaps and thicknesses. Background technique [0002] The semiconductor integrated circuit (IC) industry has experienced rapid development. During IC evolution, functional density (ie, the number of interconnected devices per chip area) has generally increased while geometry size (ie, the smallest component (or line) that can be created using a fabrication process) has decreased. This downscaling process generally offers many benefits by increasing throughput efficiency and reducing associated costs. However, this scaling down process has also been accompanied by increased design and manufacturing complexity introduced into these IC devices, thus requiring similar advances in device fabrication in order to achieve these advances. [0003] As just one example, many fabrication steps involve fabrication tools proximate po...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B17/00G01B17/02
CPCG01B17/00G01B17/02B08B13/00G01B21/16H01L21/67253G01B17/025B08B3/04B08B5/02G01N29/44G01N2291/044H01L21/02041H01L21/02282H01L21/02623H01L21/288H01L22/10
Inventor 邓君浩李雨青林冠文秦圣基
Owner TAIWAN SEMICON MFG CO LTD