Cooler assembly, and method of manufacturing the cooler assembly
A technology of coolers and components, applied in semiconductor/solid-state device manufacturing, cooling/ventilation/heating transformation, semiconductor/solid-state device components, etc., can solve problems such as large size and achieve the effect of suppressing large-scale
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no. 1 approach
[0080] figure 1 It is a figure which shows the whole structure of the cooler unit 1 which concerns on this Embodiment of this invention. figure 2 It is a figure which looked at the cooler unit 1 from one side of the tube stacking direction DRst.
[0081] The cooler module 1 is a laminated heat exchanger that cools a heat-exchanging object by exchanging heat between the refrigerant circulating inside and the heat-exchanging object. Specifically, the object to be cooled, which is the object of heat exchange, is a plurality of electronic components 4 formed in a plate shape, and the cooler unit 1 cools the electronic components 4 from both sides of the electronic components 4 . As the refrigerant of the cooler unit 1 , water mixed with, for example, glycol-based antifreeze, that is, cooling water is used. in addition, figure 1 The tube stacking direction DRst, the tube length direction DRtb, and the following figure 2 All the tube width directions DRw are directions perpe...
no. 2 approach
[0146] In the above-mentioned first embodiment, the structure in which the gap between two adjacent cooling tubes 2 among the plurality of cooling tubes 2 is narrowed due to the deformation of the diaphragm portion 23 has been described, but instead, in this In the second embodiment, an example in which the interval between two adjacent cooling pipes 2 among the plurality of cooling pipes 2 is narrowed due to the deformation of the bellows will be described.
[0147] The cooler unit 1 of the present embodiment is different from the cooler unit 1 of the first embodiment described above only in the supply header 11 and the discharge header 12 , and the other configurations are the same. Therefore, the supply header 11 and the discharge header 12 in the cooler unit 1 of the present embodiment will be described.
[0148] Figure 9 The vicinity of the supply header 11 of the cooler assembly 1 of this embodiment is shown in . In the supply header 11 of the present embodiment, the ...
no. 3 approach
[0156] In the above-mentioned first embodiment, an example in which one plate portion 30 is used for the cooler 10 has been described, but instead, in this third embodiment, two plate portions (30A , 30B) for example.
[0157] Figure 10 It is a sectional view showing the overall structure of the cooler unit 1 of the present embodiment. exist Figure 10 in, with figure 1 The same symbols denote the same components, and descriptions thereof are omitted.
[0158] The cooler unit 1 includes a plate portion (first support member) 30A and a plate portion (second support member) 30B instead of the plate portion 30 . The plate portion 30A is disposed on one side in the tube stacking direction DRst with respect to the main body portion 20 . The plate portion 30B is arranged on the other side in the tube stacking direction DRst with respect to the main body portion 20 .
[0159] Protruding openings 32 and 33 , a contact portion 36 and a through hole 37 are formed in the plate po...
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