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Cooler assembly, and method of manufacturing the cooler assembly

A technology of coolers and components, applied in semiconductor/solid-state device manufacturing, cooling/ventilation/heating transformation, semiconductor/solid-state device components, etc., can solve problems such as large size and achieve the effect of suppressing large-scale

Active Publication Date: 2019-04-23
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the physique of the plate portion 30C is enlarged

Method used

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  • Cooler assembly, and method of manufacturing the cooler assembly
  • Cooler assembly, and method of manufacturing the cooler assembly
  • Cooler assembly, and method of manufacturing the cooler assembly

Examples

Experimental program
Comparison scheme
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no. 1 approach

[0080] figure 1 It is a figure which shows the whole structure of the cooler unit 1 which concerns on this Embodiment of this invention. figure 2 It is a figure which looked at the cooler unit 1 from one side of the tube stacking direction DRst.

[0081] The cooler module 1 is a laminated heat exchanger that cools a heat-exchanging object by exchanging heat between the refrigerant circulating inside and the heat-exchanging object. Specifically, the object to be cooled, which is the object of heat exchange, is a plurality of electronic components 4 formed in a plate shape, and the cooler unit 1 cools the electronic components 4 from both sides of the electronic components 4 . As the refrigerant of the cooler unit 1 , water mixed with, for example, glycol-based antifreeze, that is, cooling water is used. in addition, figure 1 The tube stacking direction DRst, the tube length direction DRtb, and the following figure 2 All the tube width directions DRw are directions perpe...

no. 2 approach

[0146] In the above-mentioned first embodiment, the structure in which the gap between two adjacent cooling tubes 2 among the plurality of cooling tubes 2 is narrowed due to the deformation of the diaphragm portion 23 has been described, but instead, in this In the second embodiment, an example in which the interval between two adjacent cooling pipes 2 among the plurality of cooling pipes 2 is narrowed due to the deformation of the bellows will be described.

[0147] The cooler unit 1 of the present embodiment is different from the cooler unit 1 of the first embodiment described above only in the supply header 11 and the discharge header 12 , and the other configurations are the same. Therefore, the supply header 11 and the discharge header 12 in the cooler unit 1 of the present embodiment will be described.

[0148] Figure 9 The vicinity of the supply header 11 of the cooler assembly 1 of this embodiment is shown in . In the supply header 11 of the present embodiment, the ...

no. 3 approach

[0156] In the above-mentioned first embodiment, an example in which one plate portion 30 is used for the cooler 10 has been described, but instead, in this third embodiment, two plate portions (30A , 30B) for example.

[0157] Figure 10 It is a sectional view showing the overall structure of the cooler unit 1 of the present embodiment. exist Figure 10 in, with figure 1 The same symbols denote the same components, and descriptions thereof are omitted.

[0158] The cooler unit 1 includes a plate portion (first support member) 30A and a plate portion (second support member) 30B instead of the plate portion 30 . The plate portion 30A is disposed on one side in the tube stacking direction DRst with respect to the main body portion 20 . The plate portion 30B is arranged on the other side in the tube stacking direction DRst with respect to the main body portion 20 .

[0159] Protruding openings 32 and 33 , a contact portion 36 and a through hole 37 are formed in the plate po...

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Abstract

A cooler module has a cooling tube and a support member. The cooling tube has a first protruding tube portion and a second protruding tube portion. The first protruding tube portion is provided with a first flexible portion formed in an annular shape. The second protruding tube portion is provided with a second flexible portion formed in an annular shape. The support member has a first fitting portion fitted to the first protruding tube portion and a second fitting portion fitted to the second protruding tube portion. The support member supports a longitudinal center portion of the cooling tube on a condition that the first protruding tube portion and the first fitting portion are fitted together, the second protruding tube portion and the second fitting portion are fitted together, and the first flexible portion and the second flexible portion are recessed toward an inside of the cooling tube.

Description

[0001] Cross-references to related applications [0002] This application is based on Japanese Patent Application No. 2014-193184 filed on September 23, 2014, Japanese Patent Application No. 2015-168149 filed on August 27, 2015, and Japanese Patent Application filed on August 31, 2015 No. 2015-171146, the disclosure content of which is incorporated into this application by reference. technical field [0003] The present invention relates to a cooler assembly for cooling an object to be cooled and a method for manufacturing the cooler assembly. Background technique [0004] There is a current conversion device, which is composed of a cooler and a plate, wherein the cooler includes a plurality of cooling tubes, and the cooling tubes and semiconductor modules are alternately stacked, and the plate is arranged on the side of the cooler. One side of the tube stacking direction DRst (for example, refer to Patent Document 1). [0005] The center of each of the plurality of coolin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473H05K7/20
CPCH01L23/3736H01L23/473H05K7/20927F28F3/086F28F9/001F28F2255/02H01L21/4803H01L25/074H01L25/18
Inventor 冨田亮平岛津智宽
Owner DENSO CORP