Wet type metallization treatment monitoring and controlling system for policapram or polyethylene terephthalate base material

Abstract

The invention provides a wet type metallization treatment monitoring and controlling system for a policapram or polyethylene terephthalate base material. A supplementing device with the online real-time load factor detection characteristic is utilized so as to control the stability of a needed solution during continuous operation. A silane coupling unit, a catalytic treatment unit and nickel-electroplating-free treatment unit are included, and are used for forming a silane layer on the base material, forming a catalytic layer on the silane layer and forming a nickel-electroplating-free layer on the catalytic layer correspondingly, so that a multi-layer composite structure can be formed. The nickel-electroplating-free treatment unit comprises a nickel-electroplating-free treatment tank, a nickel-electroplating-free treatment solution, a nickel-electroplating-free treatment solution deploying and storing barrel and a nickel-electroplating-free control unit, the nickel-electroplating-free control unit controls and maintains the nickel content of the nickel-electroplating-free treatment solution, the nickel deposition rate can be stabilized, and the overall characteristic of the multi-layer composite structure is improved.

Description

technical field [0001] The invention relates to a monitoring and control system for wet metallization of polyacetamide or polyethylene terephthalate substrates, especially when using a supplementary device with on-line real-time load factor detection characteristics to control continuous operation The stability of the solution is to maintain a stable and fixed nickel deposition rate and complete the metallization treatment, and form a multi-layer composite structure of electroless nickel, palladium catalyst, silane, and polymer in the nano-molecular structure layer, which is suitable for realizing Wet metallization of polyacetamide (PI) or polyethylene terephthalate (PET) copper foil (Copper Foil, FC) roll-to-roll substrates. Background technique [0002] With the continuous improvement of the production process, the current portable electronic products have been able to meet the user's requirements for lightness, thinness, shortness, and smallness, such as mobile phones, di...

AI Technical Summary

Problems solved by technology

[0004] In the sputtering-electroplating copper method, the continuous vacuum evaporation process chamber system requires a very expensive investment, and the metal target is also quite expensive, thus posing a big obstacle

[0005] However, the technical problem with the sputtering method is that it is difficult to pattern etch

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