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Aircraft thermal management system

A management system and aircraft technology, applied in the field of aircraft, can solve problems such as damage to electronic components of aircraft and system inefficiency

Inactive Publication Date: 2017-08-08
GENERAL ELECTRIC CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Excessive cooling can lead to system inefficiency when heat output is relatively low
Over time, excessive cooling can even lead to damage to the aircraft's electronic components

Method used

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  • Aircraft thermal management system
  • Aircraft thermal management system
  • Aircraft thermal management system

Examples

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Embodiment Construction

[0114] Reference will now be made in detail to embodiments of the invention, one or more examples of which are illustrated in the accompanying drawings. Each example is provided by way of explanation of the invention, not limitation of the invention. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the scope or spirit of the invention. For example, features illustrated and described as part of one embodiment can be used with another embodiment to yield yet a further embodiment. Thus, it is intended that the present invention cover such modifications and variations as come within the scope of the appended claims and their equivalents.

[0115] As used herein, the terms "first," "second," and "third" may be used interchangeably to distinguish one component from another and are not intended to denote the location or importance of individual components.

[0116] The term...

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PUM

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Abstract

The invention relates to an aircraft thermal management system. Specifically, a thermal management system (20) for an aircraft is provided. The thermal management system (20) may comprise a first vapor compression circuit (44), a second vapor compression circuit (46), and an intercooler (58). The first vapor compression circuit (44) may define a first flowpath for fluid compression, condensation, expansion, and evaporation. The second vapor compression circuit (46) may define a second flowpath for fluid compression, condensation, expansion, and evaporation. The intercooler (58) may be disposed in cascading thermal communication between the first vapor compression circuit (44) and the second vapor compression circuit (46). Generally, heat generated by the aircraft may be transferred to the first vapor compression circuit (44) during aircraft operation.

Description

technical field [0001] The present subject matter relates generally to aircraft and, more particularly, to thermal management systems for aircraft. Background technique [0002] As aircraft have evolved, they have become increasingly dependent on various electronic devices to manage the aircraft's subsystems and operations. With this increased dependency, the number of electronic components within modern aircraft has exploded. While the proliferation of electronic components has brought about many improvements, it has also increased the amount of heat generated in and around the different components of the aircraft. Likewise, the demands on aircraft cooling systems have increased. Cooling requirements are only expected to increase in the future. It is expected that future aircraft will require cooling at the megawatt (MV) level rather than the kilowatt (KW) level required by current aircraft. However, existing cooling systems will not be able to handle such high loads. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B64D13/06
CPCB64D13/06B64D2013/0614F25B6/04F25B25/005B64D2013/064B64D2013/0674F25B2339/047F25B7/00B64D13/08B64D41/00F02C3/04F05D2220/323
Inventor K.E.欣德利特
Owner GENERAL ELECTRIC CO