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Integrated circuit, electronic device and method for transmitting data

A technology for integrated circuits and electronic equipment, applied in the electrical field, can solve problems such as crosstalk, affecting signal reception, and achieve the effect of avoiding crosstalk problems

Active Publication Date: 2017-08-08
MEDIATEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there may be issues with crosstalk between adjacent conductive traces on a printed circuit board, especially in high signal rate applications
Therefore, this crosstalk issue can adversely affect the signals transmitted in the conductive traces and ultimately the signal reception of the electronic components supported by the printed circuit board

Method used

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  • Integrated circuit, electronic device and method for transmitting data
  • Integrated circuit, electronic device and method for transmitting data
  • Integrated circuit, electronic device and method for transmitting data

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Embodiment Construction

[0028] Certain terms are used throughout the specification and following claims to refer to particular components. Those skilled in the art should understand that hardware manufacturers may use different names to refer to the same component. This document does not use the difference in name as a way to distinguish components, but uses the difference in function of components as a criterion for distinguishing. In the following description and claims, the terms "comprising" and "comprising" are open-ended terms, so they should be interpreted as "including but not limited to". In addition, the term "coupled" herein includes direct and indirect electrical connection means. Therefore, if a device is coupled to another device, it means that the one device may be directly electrically connected to the other device, or indirectly electrically connected to the other device through other devices or connecting means.

[0029] figure 1 An electronic device 100 is shown according to one...

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PUM

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Abstract

The invention provides an integrated circuit, an electronic device and a method for transmitting data. The integrated circuit includes a control circuit, a plurality of pins coupled to a plurality of conductive traces of a printed circuit board (PCB), and a plurality of driving units coupled to the pins. The control circuitry provides a plurality of control signals according to data to be transmitted. The driving units are divided into a plurality of first driving units and second driving units. According to the control signals, the first driving units provide the data to a memory device of the PCB via the corresponding pins and the corresponding conductive traces of PCB, and the second driving units provide a constant voltage to the corresponding conductive traces of PCB via the corresponding pins. The conductive traces corresponding to the second driving units are separated by the conductive traces corresponding to the first driving units on the PCB.

Description

[0001] 【Technical field】 [0002] The invention relates to the field of electricity, in particular to an integrated circuit, an electronic device and a data transmission method. [0003] 【Background technique】 [0004] In electronic equipment, a printed circuit board (Printed Circuit Board, PCB) is physically supported and electrically grounded by conductive traces (such as signal traces or ground traces) or conductive traces etched on a metal plate superimposed on a non-conductive core substrate. Connect multiple electronic components. In recent years, semiconductor chip package designs have required more input / output connections for multi-function, and more memory chips. Such requirements place great pressure on printed circuit board manufacturers to reduce the width and space of the conductive traces, or will lead to an increase in the number of layers of the printed circuit board. Conductive traces for transmitting signals corresponding to the same function need to be arr...

Claims

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Application Information

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IPC IPC(8): G05B19/04
CPCG05B19/04H01L23/5225H01L23/552H01L25/0655H01L2224/16227H01L2924/1436H01L2924/15192H04B3/32H05K1/0218H05K1/0219H05K1/0228H05K1/0243H05K2201/10159H05K2201/10212H01L23/48
Inventor 张峻玮陈尚斌
Owner MEDIATEK INC