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A cutting method for super-large silicon wafers

A super-sized, cutting-method technology, used in fine working devices, manufacturing tools, stone processing equipment, etc., can solve the problems of scratches on silicon wafers, inability to cut silicon wafers well, and uneven force of operators

Active Publication Date: 2019-03-22
江苏美科太阳能科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Silicon wafer is one of the most important basic materials in the microelectronics industry, and it is used in many researches. The existing method of cutting silicon wafers is to use tools such as glass knives and auxiliary tools such as rulers directly in the cutting process. Draw a line on the silicon wafer, and then cut the silicon wafer. However, due to the uneven force of the operator, the silicon wafer is often not cut well. First, the material is wasted, and second, there are often scratches on the cut silicon wafer. It is easy to affect the effect of use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] This embodiment provides a cutting method for super-large silicon wafers. The steel wire with a diameter of 0.3mm is wound on the guide wheel to form a steel wire mesh. , the steel wire mesh entrains the slurry to cut and process the silicon ingot, which mainly includes the following process, adjusting the wire slot-loading positioning-cutting-cutting-shaping, of which:

[0024] (1) The line squarer includes the main guide wheel, the secondary guide wheel, the No. 1 guide wheel and the No. 2 guide wheel. Each guide wheel is composed of multiple single-piece guide wheels. The groove distance of each single-piece guide on the guide wheel is respectively 158mm, there are 7 grooves on the single-piece guide wheel, the distance between adjacent grooves on the single-piece guide wheel is 2mm, the depth of each groove is 1mm, and the angle between the grooves is 65°. When wiring, the first single-piece guide wheel on the guide wheel The first groove is used on the wheel, and o...

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Abstract

The invention discloses a cutting method for oversized silicon wafers. According to the cutting method, steel wires are wound around wire guide wheels to form a steel wire net, and through the operation of the wire guide wheels, silicon ingots are cut by the steel wire net with slurry, and the cutting method mainly comprises the following processes of trunking adjusting, feeding and positioning, cutting, discharging and reforming. The cutting method is simple and easy to implement, and by the adoption of the cutting method, the oversized silicon wafers can be obtained through cutting.

Description

technical field [0001] The invention designs a method for cutting a silicon chip, and in particular relates to a method for cutting a super-sized silicon chip. Background technique [0002] Silicon wafer is one of the most important basic materials in the microelectronics industry, and it is used in many researches. The existing method of cutting silicon wafers is to use tools such as glass knives and auxiliary tools such as rulers directly in the cutting process. Draw a line on the silicon wafer, and then cut the silicon wafer. However, due to the uneven force of the operator, the silicon wafer is often not cut well. First, the material is wasted, and second, there are often scratches on the cut silicon wafer. It is easy to affect the effect of use. Contents of the invention [0003] The technical problem to be solved by the present invention is to propose a method for cutting super-large silicon wafers, which is simple and easy, and can cut super-large silicon wafers. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D5/00
CPCB28D5/0023B28D5/045
Inventor 朱孝吉王海庆
Owner 江苏美科太阳能科技股份有限公司
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