A cutting method for super-large silicon wafers

Abstract

The invention discloses a cutting method for oversized silicon wafers. According to the cutting method, steel wires are wound around wire guide wheels to form a steel wire net, and through the operation of the wire guide wheels, silicon ingots are cut by the steel wire net with slurry, and the cutting method mainly comprises the following processes of trunking adjusting, feeding and positioning, cutting, discharging and reforming. The cutting method is simple and easy to implement, and by the adoption of the cutting method, the oversized silicon wafers can be obtained through cutting.

Description

technical field

[0001] The invention designs a method for cutting a silicon chip, and in particular relates to a method for cutting a super-sized silicon chip. Background technique

[0002] Silicon wafer is one of the most important basic materials in the microelectronics industry, and it is used in many researches. The existing method of cutting silicon wafers is to use tools such as glass knives and auxiliary tools such as rulers directly in the cutting process. Draw a line on the silicon wafer, and then cut the silicon wafer. However, due to the uneven force of the operator, the silicon wafer is often not cut well. First, the material is wasted, and second, there are often scratches on the cut silicon wafer. It is easy to affect the effect of use. Contents of the invention

[0003] The technical problem to be solved by the present invention is to propose a method for cutting super-large silicon wafers, which is simple and easy, and can cut super-large silicon wafers. ...