Circuit module and manufacturing method thereof

Abstract

An embodiment of the invention relates to a circuit module and a manufacturing method thereof. The circuit module comprises a metal thin plate, an insulating adhesive layer and metal frames, wherein the insulating adhesive layer is arranged on the upper surface of the metal thin plate; recessions in predetermined shapes are formed in the insulating adhesive layer; the metal frames are arranged in the recessions and matched with the recessions in shapes; a plurality of circuit elements are fixed on the metal frames; at least one heat radiating block is fixed on each of part of the circuit elements; the protective layer and the metal thin plate form an enclosed space to seal the insulating adhesive layer, the metal frames, the plurality of circuit elements and the lower half portion of the at least one heat radiating block; the lower half portion refers to the portion between a contact surface of the radiating block and the corresponding circuit element and a surface, away from the metal thin plate, of the protective layer; a plurality of pins are arranged at preset positions of the edges of the metal frames; and one end of each pin is arranged inside the enclosed space and is electrically connected with the corresponding metal frame, and the other end is arranged outside the enclosed space. The circuit module and the manufacturing method thereof can reduce the occurrence possibility of short circuit, and can improve the radiating effect.

Description

technical field [0001] The invention relates to the technical field of power supplies, in particular to a circuit module and a manufacturing method thereof. Background technique [0002] Circuit modules need to dissipate heat during operation, and the most obvious one is the intelligent power module. Intelligent Power Module (IPM) is a power drive product that uses power electronic devices and integrated circuits to output preset voltage and preset power. In practical applications, the intelligent power module is used in conjunction with a Microcontroller Unit (MCU), that is, the intelligent power module receives the control signal of the MCU on the one hand to drive the subsequent circuit to work, and on the other hand feeds back the detection signal of the subsequent circuit to the MCU, so as to It is convenient for the MCU to adjust the control signal. Due to the advantages of high integration and high reliability, the above-mentioned intelligent power modules are widel...

AI Technical Summary

Problems solved by technology

[0018] In view of the defects in the prior art, the embodiment of the present invention provides a circuit module and its manufacturing method to solve the problem that the circuit wiring of the existing circuit module is prone to short-circuit under severe working conditions and affects its normal use.

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