Bar-shaped light emitting element, backlight module and electronic equipment

A light-emitting element and strip-shaped technology, which is applied to semiconductor devices of light-emitting elements, optical elements for changing the spectral characteristics of emitted light, electrical elements, etc. User experience, avoid the effect of uneven display brightness

Inactive Publication Date: 2017-08-18
SHENZHEN LT OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to overcome the technical problem of large size of existing electronic equipment, the present invention provides a strip-shaped light-emitting element, a backlight module and electronic equipment

Method used

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  • Bar-shaped light emitting element, backlight module and electronic equipment
  • Bar-shaped light emitting element, backlight module and electronic equipment
  • Bar-shaped light emitting element, backlight module and electronic equipment

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Embodiment Construction

[0048] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0049] see figure 1 , figure 2 and image 3 The first embodiment of the present invention provides a strip-shaped light-emitting element 1, which includes a fluorescent film layer 11, at least two LED chips 12, an adhesive layer 13, a substrate 15, a circuit board 16 and a conductive circuit (not shown). The at least two LED chips 12 are disposed between the fluorescent film layer 11 and the substrate 15 . The circuit board 16 is perpendicular to the plane where the surface of the substrate 15 where the LED chip 12 is located. Wherein, the fluorescent film layer 11 is provided...

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Abstract

The invention relates to a bar-shaped light emitting element, a backlight module equipped with the bar-shaped light emitting element and electronic equipment. The bar-shaped light emitting element comprises a fluorescent film layer, at least two LED chips, a substrate and a circuit board, wherein the at least two LED chips are arranged between the fluorescent film layer and the substrate, and the circuit board is perpendicular to a plane of a substrate surface on which the chips are arranged. Through arranging the circuit board perpendicular to the plane of the substrate surface on which the chips are arranged, a side surface of the substrate is facilitated to connect with an external power-supply power or the circuit board, the size of the electronic equipment can be reduced substantially, light and thin development demands of the electronic equipment can be satisfied, and user experience is improved. Light emitted by the LED chips can be prevented from shielding, and light emitting intensity and uniformity are guaranteed; the backlight module and the electronic equipment have advantages of simple manufacturing process, low manufacturing cost, uniform emitting light without dark areas and high intensity.

Description

[0001] 【Technical field】 [0002] The invention relates to the field of electronic products, in particular to a strip-shaped light-emitting element, a backlight module and electronic equipment. [0003] 【Background technique】 [0004] With the development and maturity of LED technology, the performance of LED is improving day by day, and the research and development of LED technology is becoming more and more active, and LED has also been used more and more. [0005] At present, the application range of LED electronic equipment is becoming wider and wider, and people's requirements for the quality of LED electronic equipment are also getting higher and higher. However, in existing LED electronic equipment, LED chips, substrates, circuit boards or external power supplies are generally packaged in stacks, and soldering wires are used to electrically connect the LED chips to the substrate, so it takes up more space and the overall volume is too large to adapt to People's demand f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/50H01L33/62G02F1/13357
CPCF21K9/90F21S8/00F21V9/00F21V19/001F21V23/005F21V23/06F21V2200/20G02F1/133603H01L25/0753H01L33/20H01L33/50H01L33/58H01L33/62G02F1/133602G02F1/133614F21S4/28F21K9/60F21Y2105/10F21Y2115/10
Inventor 王磊
Owner SHENZHEN LT OPTOELECTRONICS CO LTD
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