Modularized nozzle for spatially-separated atomic layer deposition, and apparatus

Abstract

The invention discloses a modularized nozzle for spatially-separated atomic layer deposition, and an apparatus. The modularized nozzle comprises a precursor channel assembly and a sealing assembly, wherein the precursor channel assembly comprises a plate-shaped substrate, a precursor channel and a gas pipeline; the precursor channel is arranged on the front of the plate-shaped substrate and extends from top to bottom; the top end of the precursor channel is communicated with the gas pipeline; and the sealing assembly is arranged on the front of the plate-shaped substrate and used for sealing the precursor channel to prevent leakage of a precursor. The modularized nozzle is an integral module composed of a plurality of parts and employs the precursor channel for diversion and buffering of injected gas so as to realize uniform deposition; and the modularized nozzles can be combined at will according to practical needs. The apparatus comprises a plurality of the modularized nozzles which are arranged at a certain interval; and oxide precursor sources and a metal precursor source are separately introduced so as to allow a plurality of film layers to be deposited after the substrate moves to and fro once below a precursor unit, so film deposition efficiency is substantially improved.

Description

technical field [0001] The invention belongs to the field of thin film preparation by atomic deposition, and more specifically relates to a modular nozzle and a device for space-isolated atomic layer deposition. Background technique [0002] With its unique flexibility, ductility, and low-cost manufacturing process, flexible electronics has broad application prospects in information, energy, medical, flexible display and other fields. The manufacturing process of flexible electronics includes: material preparation-thin film deposition-patterning-encapsulation-functional integration, in which the performance of the thin film layer directly determines the electrical, mechanical and sealing properties of flexible electronic devices. Compared with traditional thin film preparation technologies such as chemical vapor deposition (CVD) and physical vapor deposition (PVD), atomic layer deposition (ALD) has the characteristics of high step coverage, suitable for large surface deposit...

AI Technical Summary

Problems solved by technology

Its purpose is to divert and buffer the injected gas through the precursor channel, thereby solving the problems of uneven film growth and cross-contamination of the precursor when the spatially isolated atomic layer system moves at high speed on the substrate, and realizes efficient, rapid and large-area uniform thin film deposition

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