Full-automatic welding machine and welding method thereof

Abstract

The invention discloses a full-automatic welding machine, and belongs to the technical field of electronic component welding. The full-automatic welding machine comprises a rack, a feeding mechanism, a welding carrying platform tool, a first loading and unloading mechanism, a welding mechanism, a rotation disc, a plurality of turnover press mechanisms, a second loading and unloading mechanism, a flexible printed circuit (FPC) turnover mechanism, a bonding pad wiping mechanism, a post-welding height detection mechanism, a post-welding charge coupled device (CCD) detection mechanism, an insulation adhesive tape attachment mechanism and an adhesive tape pressure maintaining mechanism, wherein the rotation disc is driven by a rotation driving device. The invention also discloses a welding method of the full-automatic welding machine. The welding method comprises the steps of feeding, tool loading, tool rotation, fine positioning of an FPC, FPC welding, tool unloading, turnover press mechanism loading, turnover and pressing of the FPC after welding, bonding pad wiping, height detection, CCD detection, adhesive tape pasting, adhesive tape pressure maintenance and product flowing out. By the full-automatic welding machine and the welding method, automatic welding and post-welding processing of a pin and a bonding pad are achieved, the production efficiency is improved, and the welding quality of a product and the consistency of the product are ensured.

Description

technical field [0001] The invention belongs to the technical field of electronic component welding, and in particular relates to a fully automatic welding machine and a welding method for the fully automatic welding machine. Background technique [0002] In the assembly and production process of TP (Touch Panel, touch panel) and LCM (LCD Module, liquid crystal display module), such as figure 1 As shown, the backlight pin 101 of the liquid crystal screen 100 with TP and the pad 201 of the FPC200 (Flexible Printed Circuit, flexible circuit board) need to be connected by soldering. Since the pad 201 on the FPC200 is facing the back of the TP (the back refers to the side of the TP close to the FPC), the TP will cover the pad, and the FPC200 needs to be folded before soldering, as in figure 2 shown so that the pad is exposed. and, if image 3 and Figure 4 Commonly shown, in the initial state, the backlight pin 101 of the liquid crystal screen 100 with TP is located at the ...

AI Technical Summary

Problems solved by technology

Since the pads on the FPC200 face the back of the TP, the TP will cover the pads. Before each station is operated, it is necessary to manually fold the FPC200 to the back of the screen, such as figure 2 As shown, to expose the pads and pins, not only the production efficiency is low and the labor intensity is high, but also human factors have a great influence on the post-soldering processing steps, which also leads to poor product consistency

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